StreetInsider.com News Articles

Renesas Launches RX74M and RX74N Flagship 32-bit MCUs, First RX Family Built on 22nm Process and Featuring MRAM

Thu, 22 Oct 2026 08:00:00 -0400

Up to 600 MHz RXv3e core and high-speed MRAM deliver fast, reliable real-time performance.
RX74M supports major industrial networks—including EtherCAT, TSN-capable Gigabit Ethernet, and CAN FD on a single device.
Hardware-based security features address next-generation security requirements such as compliance with the Cyber Resilience Act and support for post-quantum cryptography.

TOKYO--(BUSINESS WIRE)-- Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched the RX74M and RX74N, new flagship 32-bit microcontrollers (MCUs) that deliver up to 600 MHz performance and are the first in the RX Family to be built on a 22nm process and incorporate embedded

Renesas Launches RX74M and RX74N Flagship 32-bit MCUs, First RX Family Built on 22nm Process and Featuring MRAM

Thu, 22 Oct 2026 08:00:00 -0400

Up to 600 MHz RXv3e core and high-speed MRAM deliver fast, reliable real-time performance.
RX74M supports major industrial networks—including EtherCAT, TSN-capable Gigabit Ethernet, and CAN FD on a single device.
Hardware-based security features address next-generation security requirements such as compliance with the Cyber Resilience Act and support for post-quantum cryptography.

Renesas Expands GaN Portfolio with First Low-Voltage GaN FETs for AI Data Centers and Robotics

Tue, 06 Oct 2026 08:00:00 -0400

New 100V E-mode GaN Advanced Power Transistor Family Delivers Higher Power Density and Industry-Leading Figure-of-Merit Performance

TOKYO--(BUSINESS WIRE)-- Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has expanded its GaN portfolio into low-voltage applications with its first family of 100V enhancement mode (E-mode) GaN-based discrete power transistors. The RTP100E005G1FL, RTP100E2P6G1FL, RTP100E1P8G1FL-DSC and RTP100E1P2G1FL-DSC low-voltage GaN FETs deliver ultra-fast switching speeds and enhanced thermal performance in efficiency-critical, high power density applications, including AI data centers, humanoid robotics, factory automation and industrial motor drives, power tools and solar microinverters.

This press release features multimedia. View the

Renesas Expands GaN Portfolio with First Low-Voltage GaN FETs for AI Data Centers and Robotics

Tue, 06 Oct 2026 08:00:00 -0400

New 100V E-mode GaN Advanced Power Transistor Family Delivers Higher Power Density and Industry-Leading Figure-of-Merit Performance

This press release features multimedia. View the

Renesas Unveils Industry's First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Wed, 30 Sep 2026 08:00:00 -0400

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into space-constrained megawatt-scale racks.
One of the lowest on resistances in the 650V class, at 20 mΩ in an 8x8 mm package.
Single-source path to 800V designs with industry-standard PQFN footprint plus full controller, driver and MCU lineup. These solutions will be on display at OCP Global Summit in San Jose, CA, October 12-15.

TOKYO--(BUSINESS WIRE)-- Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today launched the industry's first 650V GaN device with dual-side cooling for high-density power conversion in 800V

Renesas Unveils Industry's First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Wed, 30 Sep 2026 08:00:00 -0400

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into space-constrained megawatt-scale racks.
One of the lowest on resistances in the 650V class, at 20 mΩ in an 8x8 mm package.
Single-source path to 800V designs with industry-standard PQFN footprint plus full controller, driver and MCU lineup. These solutions will be on display at OCP Global Summit in San Jose, CA, October 12-15.

Renesas Introduces Smallest Configurable GreenPAK IC with Multi-Time Programmability in Ultra-Compact WLCSP and STQFN Packages

Thu, 24 Sep 2026 08:00:00 -0400

The industry's smallest WLCSP-packaged GreenPAK device, featuring a 9-ball, 1.155 mm × 1.155 mm, with an STQFN option for additional I/O and package flexibility.
Multi-time programmable and target I²C enable in-system bug fixes, updates and configuration changes after deployment
Full 1.71 V to 5.5 V operating and configurable range supports versatile, low-cost sensing, control and glue-logic functions

TOKYO--(BUSINESS WIRE)-- Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the SLG46801, the industry’s smallest GreenPAK configurable mixed-signal device offered in both WLCSP and STQFN packages. The 9-ball WLCSP measures just 1.155 mm × 1.155 mm and

Renesas Introduces Smallest Configurable GreenPAK IC with Multi-Time Programmability in Ultra-Compact WLCSP and STQFN Packages

Thu, 24 Sep 2026 08:00:00 -0400

The industry's smallest WLCSP-packaged GreenPAK device, featuring a 9-ball, 1.155 mm × 1.155 mm, with an STQFN option for additional I/O and package flexibility.
Multi-time programmable and target I²C enable in-system bug fixes, updates and configuration changes after deployment
Full 1.71 V to 5.5 V operating and configurable range supports versatile, low-cost sensing, control and glue-logic functions

Renesas Launches 64-bit RZ/G3L and RZ/G3SE MPUs for Advanced HMI and IoT Edge Systems

Thu, 10 Sep 2026 08:00:00 -0400

Pin-compatible MPUs enable scalable design on common PCB
1 mW-level standby power and fast Linux wakeup enable always-connected applications
PCIe and TSN-capable Ethernet provide high-speed connectivity and flexible system expansion

TOKYO--(BUSINESS WIRE)-- Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today expanded its RZ/G Series with new 64-bit general-purpose microprocessors (MPUs) for Human Machine Interface (HMI) and IoT edge systems. The RZ/G3L and RZ/G3SE are pin-compatible MPUs that support a broad range of industrial and consumer HMI and IoT gateway and home gateway systems requiring high processing performance and high-speed network connectivity.

This press release features

Renesas Launches 64-bit RZ/G3L and RZ/G3SE MPUs for Advanced HMI and IoT Edge Systems

Thu, 10 Sep 2026 08:00:00 -0400

Pin-compatible MPUs enable scalable design on common PCB
1 mW-level standby power and fast Linux wakeup enable always-connected applications
PCIe and TSN-capable Ethernet provide high-speed connectivity and flexible system expansion

This press release features

Renesas Establishes Physical AI & Robotics Lab in Beijing to Accelerate Next-Generation Robotics Innovation

Wed, 26 Aug 2026 22:00:00 -0400