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SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SEOUL, South Korea, May 25, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)^[1] within the high-bandwidth memory(HBM) package for next-generation HBM products.

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix unveils 'iHBM' thermal solution to boost AI performance

Mon, 25 May 2026 19:39:00 -0400

Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility

SK hynix receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM

Sat, 25 Apr 2026 20:15:00 -0400

SK hynix honored at the 2026 IEEE Awards for leading AI technology innovation with HBM
Contributed to the global AI computing ecosystem via stable mass production across all HBM generations
Company committed to becoming a premier leader in AI innovation through collaboration with global customers and partners

SEOUL, South Korea, April 25, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it received the Corporate Innovation Award at the '2026 IEEE¹ Honors Ceremony' held in New York on the 24th (local time).

IEEE

SK hynix receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM

Sat, 25 Apr 2026 20:15:00 -0400

SK hynix honored at the 2026 IEEE Awards for leading AI technology innovation with HBM
Contributed to the global AI computing ecosystem via stable mass production across all HBM generations
Company committed to becoming a premier leader in AI innovation through collaboration with global customers and partners

IEEE

SK hynix receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM

Sat, 25 Apr 2026 20:15:00 -0400

SK hynix honored at the 2026 IEEE Awards for leading AI technology innovation with HBM
Contributed to the global AI computing ecosystem via stable mass production across all HBM generations
Company committed to becoming a premier leader in AI innovation through collaboration with global customers and partners

IEEE

SK hynix receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM

Sat, 25 Apr 2026 20:15:00 -0400

SK hynix honored at the 2026 IEEE Awards for leading AI technology innovation with HBM
Contributed to the global AI computing ecosystem via stable mass production across all HBM generations
Company committed to becoming a premier leader in AI innovation through collaboration with global customers and partners

IEEE

SK hynix receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM

Sat, 25 Apr 2026 20:15:00 -0400

SK hynix honored at the 2026 IEEE Awards for leading AI technology innovation with HBM
Contributed to the global AI computing ecosystem via stable mass production across all HBM generations
Company committed to becoming a premier leader in AI innovation through collaboration with global customers and partners

IEEE

SK hynix receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM

Sat, 25 Apr 2026 20:15:00 -0400

SK hynix honored at the 2026 IEEE Awards for leading AI technology innovation with HBM
Contributed to the global AI computing ecosystem via stable mass production across all HBM generations
Company committed to becoming a premier leader in AI innovation through collaboration with global customers and partners

IEEE

SK hynix receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM

Sat, 25 Apr 2026 20:15:00 -0400

SK hynix honored at the 2026 IEEE Awards for leading AI technology innovation with HBM
Contributed to the global AI computing ecosystem via stable mass production across all HBM generations
Company committed to becoming a premier leader in AI innovation through collaboration with global customers and partners

IEEE

SK hynix receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM

Sat, 25 Apr 2026 20:15:00 -0400

SK hynix honored at the 2026 IEEE Awards for leading AI technology innovation with HBM
Contributed to the global AI computing ecosystem via stable mass production across all HBM generations
Company committed to becoming a premier leader in AI innovation through collaboration with global customers and partners

IEEE

SK hynix receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM

Sat, 25 Apr 2026 20:15:00 -0400

SK hynix honored at the 2026 IEEE Awards for leading AI technology innovation with HBM
Contributed to the global AI computing ecosystem via stable mass production across all HBM generations
Company committed to becoming a premier leader in AI innovation through collaboration with global customers and partners

IEEE