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   <title>Form  SCHEDULE 13G  Fabric.AI, Inc.                        Filed by: JANE STREET GROUP, LLC</title>
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   <title>Form  SCHEDULE 13G  Fabric.AI, Inc.                        Filed by: JANE STREET GROUP, LLC</title>
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   <title>Form  ARS        Fabric.AI, Inc.           For: Dec 31</title>
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   <title>Form  ARS        Fabric.AI, Inc.           For: Dec 31</title>
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   <title>Form  DEF 14A    Fabric.AI, Inc.           For: Jun 01</title>
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   <title>Form  DEF 14A    Fabric.AI, Inc.           For: Jun 01</title>
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   <title>Fabric.AI hires Egon Zehnder to find project management executive</title>
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   <description>&lt;p&gt;Fabric.AI (NASDAQ: FABC) announced it has engaged executive search firm Egon Zehnder to find a senior project management executive, according to a company press release.&lt;/p&gt;&lt;p&gt;The AI infrastructure company said the new executive will help coordinate engineering, product development, partnership, and commercialization activities across the organization. Fabric.AI develops fabless semiconductor technologies for AI data centers.&lt;/p&gt;&lt;p&gt;The search follows recent organizational developments at the company. Fabric.AI named Bill Maffucci as Head of Development for its Neural I/o chip program and entered into non-disclosure agreements with two semiconductor companies to explore technology applications.&lt;/p&gt;&lt;p&gt;The company is developing MicroLED-based optical interconnects through its Neural I/o program</description>
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   <pubDate>Thu, 28 May 2026 09:16:24 -0400</pubDate>
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   <title>Fabric.AI Engages Egon Zehnder to Lead Search for Strategic Project Management Executive</title>
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   <description>&lt;p&gt;&lt;strong&gt;Leadership search marks the latest step in a rapid scale-up of Fabric.AI&amp;apos;s Neural I/o™ platform and broader AI infrastructure roadmap&lt;/strong&gt;&lt;/p&gt;&lt;p&gt;NEW YORK, NY, May  28, 2026  (GLOBE NEWSWIRE) -- Fabric.AI (Nasdaq: FABC) (&quot;Fabric.AI&quot; or &quot;the Company&quot;), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation &quot;AI factories,&quot; today announced that it has engaged Egon Zehnder, one of the world's preeminent executive search and leadership advisory firms, to lead the search for a senior project management executive.&lt;/p&gt;  &lt;p&gt;The engagement adds to a period of accelerating momentum for Fabric.AI. In recent months, the Company has named</description>
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   <pubDate>Thu, 28 May 2026 09:15:00 -0400</pubDate>
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   <title>Fabric.AI Engages Egon Zehnder to Lead Search for Strategic Project Management Executive</title>
   <link>http://www.streetinsider.com/Globe+Newswire/Fabric.AI+Engages+Egon+Zehnder+to+Lead+Search+for+Strategic+Project+Management+Executive/26562396.html</link>
   <description>&lt;p&gt;&lt;strong&gt;Leadership search marks the latest step in a rapid scale-up of Fabric.AI&amp;apos;s Neural I/o™ platform and broader AI infrastructure roadmap&lt;/strong&gt;&lt;/p&gt;&lt;p&gt;NEW YORK, NY, May  28, 2026  (GLOBE NEWSWIRE) -- Fabric.AI (Nasdaq: FABC) (&quot;Fabric.AI&quot; or &quot;the Company&quot;), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation &quot;AI factories,&quot; today announced that it has engaged Egon Zehnder, one of the world's preeminent executive search and leadership advisory firms, to lead the search for a senior project management executive.&lt;/p&gt;  &lt;p&gt;The engagement adds to a period of accelerating momentum for Fabric.AI. In recent months, the Company has named</description>
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   <title>Form  PRE 14A    Fabric.AI, Inc.           For: May 22</title>
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   <pubDate>Fri, 22 May 2026 17:01:00 -0400</pubDate>
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   <title>Form  PRE 14A    Fabric.AI, Inc.           For: May 22</title>
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   <title>Fabric.AI targets Neural I/o MicroLED platform demonstration by late 2026</title>
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   <description>&lt;p&gt;Fabric.AI Inc. (NASDAQ: FABC) announced it expects to demonstrate its Neural I/o MicroLED-based optical interconnect platform by the end of 2026. The AI infrastructure company is developing the technology in partnership with Kopin Corporation (NASDAQ: KOPN).&lt;/p&gt;&lt;p&gt;The Neural I/o platform addresses data movement between GPUs, accelerators, memory systems, and servers in AI data centers. Fabric.AI stated it has entered two non-disclosure agreements with chipmakers to discuss potential applications and integration opportunities for the technology.&lt;/p&gt;&lt;p&gt;The company reported approximately $30 million in cash and cash equivalents, which it believes will fund operations through the planned Neural I/o demonstration milestone.&lt;/p&gt;&lt;p&gt;&quot;AI is creating one of</description>
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   <pubDate>Mon, 18 May 2026 09:15:38 -0400</pubDate>
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   <title>Fabric.AI targets Neural I/o MicroLED platform demonstration by late 2026</title>
   <link>http://www.streetinsider.com/Corporate+News/Fabric.AI+targets+Neural+Io+MicroLED+platform+demonstration+by+late+2026/26511297.html</link>
   <description>&lt;p&gt;Fabric.AI Inc. (NASDAQ: FABC) announced it expects to demonstrate its Neural I/o MicroLED-based optical interconnect platform by the end of 2026. The AI infrastructure company is developing the technology in partnership with Kopin Corporation (NASDAQ: KOPN).&lt;/p&gt;&lt;p&gt;The Neural I/o platform addresses data movement between GPUs, accelerators, memory systems, and servers in AI data centers. Fabric.AI stated it has entered two non-disclosure agreements with chipmakers to discuss potential applications and integration opportunities for the technology.&lt;/p&gt;&lt;p&gt;The company reported approximately $30 million in cash and cash equivalents, which it believes will fund operations through the planned Neural I/o demonstration milestone.&lt;/p&gt;&lt;p&gt;&quot;AI is creating one of</description>
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   <title>Fabric.AI (Nasdaq: FABC) Targets Demonstration of Neural I/o™ MicroLED Interconnect Platform by Late 2026</title>
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&lt;p&gt;NEW YORK, NY, May  18, 2026  (GLOBE NEWSWIRE) -- Fabric.AI, Inc. (Nasdaq: FABC) (the “Company” or “Fabri.AI”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced that it expects to demonstrate its flagship &lt;b&gt;Neural I/o™&lt;/b&gt; MicroLED-based optical interconnect platform by the end of 2026.&lt;/p&gt;  &lt;p&gt;Neural I/o is being developed in partnership with &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=zDoYeNGp2--D-qzKBTc0sAI_ofjoZSstYcp1i3dc3XqEQLJZx6MVV_EqIcuj0W5l1hPs2Ulw8mhHtNGtNaBVWoA7WUkKhD1OO8cpC76UfQgBNLP-Brliu5Xv9DjPyn5o&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Kopin Corporation&lt;/a&gt; (Nasdaq:KOPN) and is designed to address one of the largest emerging bottlenecks in artificial intelligence infrastructure: the movement of data between GPUs, accelerators, memory systems, and servers inside AI data centers.&lt;/p&gt;</description>
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   <title>Fabric.AI (Nasdaq: FABC) Targets Demonstration of Neural I/o™ MicroLED Interconnect Platform by Late 2026</title>
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&lt;p&gt;NEW YORK, NY, May  18, 2026  (GLOBE NEWSWIRE) -- Fabric.AI, Inc. (Nasdaq: FABC) (the “Company” or “Fabri.AI”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced that it expects to demonstrate its flagship &lt;b&gt;Neural I/o™&lt;/b&gt; MicroLED-based optical interconnect platform by the end of 2026.&lt;/p&gt;  &lt;p&gt;Neural I/o is being developed in partnership with &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=zDoYeNGp2--D-qzKBTc0sAI_ofjoZSstYcp1i3dc3XqEQLJZx6MVV_EqIcuj0W5l1hPs2Ulw8mhHtNGtNaBVWoA7WUkKhD1OO8cpC76UfQgBNLP-Brliu5Xv9DjPyn5o&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Kopin Corporation&lt;/a&gt; (Nasdaq:KOPN) and is designed to address one of the largest emerging bottlenecks in artificial intelligence infrastructure: the movement of data between GPUs, accelerators, memory systems, and servers inside AI data centers.&lt;/p&gt;</description>
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   <title>Fabric.AI (Nasdaq: FABC) Targets Demonstration of Neural I/o™ MicroLED Interconnect Platform by Late 2026</title>
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&lt;p&gt;NEW YORK, NY, May  18, 2026  (GLOBE NEWSWIRE) -- Fabric.AI, Inc. (Nasdaq: FABC) (the “Company” or “Fabri.AI”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced that it expects to demonstrate its flagship &lt;b&gt;Neural I/o™&lt;/b&gt; MicroLED-based optical interconnect platform by the end of 2026.&lt;/p&gt;  &lt;p&gt;Neural I/o is being developed in partnership with &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=zDoYeNGp2--D-qzKBTc0sAI_ofjoZSstYcp1i3dc3XqEQLJZx6MVV_EqIcuj0W5l1hPs2Ulw8mhHtNGtNaBVWoA7WUkKhD1OO8cpC76UfQgBNLP-Brliu5Xv9DjPyn5o&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Kopin Corporation&lt;/a&gt; (Nasdaq:KOPN) and is designed to address one of the largest emerging bottlenecks in artificial intelligence infrastructure: the movement of data between GPUs, accelerators, memory systems, and servers inside AI data centers.&lt;/p&gt;</description>
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   <title>Fabric.AI (Nasdaq: FABC) Targets Demonstration of Neural I/o™ MicroLED Interconnect Platform by Late 2026</title>
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&lt;p&gt;NEW YORK, NY, May  18, 2026  (GLOBE NEWSWIRE) -- Fabric.AI, Inc. (Nasdaq: FABC) (the “Company” or “Fabri.AI”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced that it expects to demonstrate its flagship &lt;b&gt;Neural I/o™&lt;/b&gt; MicroLED-based optical interconnect platform by the end of 2026.&lt;/p&gt;  &lt;p&gt;Neural I/o is being developed in partnership with &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=zDoYeNGp2--D-qzKBTc0sAI_ofjoZSstYcp1i3dc3XqEQLJZx6MVV_EqIcuj0W5l1hPs2Ulw8mhHtNGtNaBVWoA7WUkKhD1OO8cpC76UfQgBNLP-Brliu5Xv9DjPyn5o&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Kopin Corporation&lt;/a&gt; (Nasdaq:KOPN) and is designed to address one of the largest emerging bottlenecks in artificial intelligence infrastructure: the movement of data between GPUs, accelerators, memory systems, and servers inside AI data centers.&lt;/p&gt;</description>
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   <title>Fabric.AI (Nasdaq: FABC) Targets Demonstration of Neural I/o™ MicroLED Interconnect Platform by Late 2026</title>
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&lt;p&gt;NEW YORK, NY, May  18, 2026  (GLOBE NEWSWIRE) -- Fabric.AI, Inc. (Nasdaq: FABC) (the “Company” or “Fabri.AI”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced that it expects to demonstrate its flagship &lt;b&gt;Neural I/o™&lt;/b&gt; MicroLED-based optical interconnect platform by the end of 2026.&lt;/p&gt;  &lt;p&gt;Neural I/o is being developed in partnership with &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=zDoYeNGp2--D-qzKBTc0sAI_ofjoZSstYcp1i3dc3XqEQLJZx6MVV_EqIcuj0W5l1hPs2Ulw8mhHtNGtNaBVWoA7WUkKhD1OO8cpC76UfQgBNLP-Brliu5Xv9DjPyn5o&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Kopin Corporation&lt;/a&gt; (Nasdaq:KOPN) and is designed to address one of the largest emerging bottlenecks in artificial intelligence infrastructure: the movement of data between GPUs, accelerators, memory systems, and servers inside AI data centers.&lt;/p&gt;</description>
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   <title>Fabric.AI (Nasdaq: FABC) Targets Demonstration of Neural I/o™ MicroLED Interconnect Platform by Late 2026</title>
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&lt;p&gt;NEW YORK, NY, May  18, 2026  (GLOBE NEWSWIRE) -- Fabric.AI, Inc. (Nasdaq: FABC) (the “Company” or “Fabri.AI”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced that it expects to demonstrate its flagship &lt;b&gt;Neural I/o™&lt;/b&gt; MicroLED-based optical interconnect platform by the end of 2026.&lt;/p&gt;  &lt;p&gt;Neural I/o is being developed in partnership with &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=zDoYeNGp2--D-qzKBTc0sAI_ofjoZSstYcp1i3dc3XqEQLJZx6MVV_EqIcuj0W5l1hPs2Ulw8mhHtNGtNaBVWoA7WUkKhD1OO8cpC76UfQgBNLP-Brliu5Xv9DjPyn5o&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Kopin Corporation&lt;/a&gt; (Nasdaq:KOPN) and is designed to address one of the largest emerging bottlenecks in artificial intelligence infrastructure: the movement of data between GPUs, accelerators, memory systems, and servers inside AI data centers.&lt;/p&gt;</description>
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   <title>Fabric.AI (Nasdaq: FABC) Targets Demonstration of Neural I/o™ MicroLED Interconnect Platform by Late 2026</title>
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&lt;p&gt;NEW YORK, NY, May  18, 2026  (GLOBE NEWSWIRE) -- Fabric.AI, Inc. (Nasdaq: FABC) (the “Company” or “Fabri.AI”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced that it expects to demonstrate its flagship &lt;b&gt;Neural I/o™&lt;/b&gt; MicroLED-based optical interconnect platform by the end of 2026.&lt;/p&gt;  &lt;p&gt;Neural I/o is being developed in partnership with &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=zDoYeNGp2--D-qzKBTc0sAI_ofjoZSstYcp1i3dc3XqEQLJZx6MVV_EqIcuj0W5l1hPs2Ulw8mhHtNGtNaBVWoA7WUkKhD1OO8cpC76UfQgBNLP-Brliu5Xv9DjPyn5o&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Kopin Corporation&lt;/a&gt; (Nasdaq:KOPN) and is designed to address one of the largest emerging bottlenecks in artificial intelligence infrastructure: the movement of data between GPUs, accelerators, memory systems, and servers inside AI data centers.&lt;/p&gt;</description>
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   <title>Fabric.AI (Nasdaq: FABC) Targets Demonstration of Neural I/o™ MicroLED Interconnect Platform by Late 2026</title>
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&lt;p&gt;NEW YORK, NY, May  18, 2026  (GLOBE NEWSWIRE) -- Fabric.AI, Inc. (Nasdaq: FABC) (the “Company” or “Fabri.AI”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced that it expects to demonstrate its flagship &lt;b&gt;Neural I/o™&lt;/b&gt; MicroLED-based optical interconnect platform by the end of 2026.&lt;/p&gt;  &lt;p&gt;Neural I/o is being developed in partnership with &lt;a target=&quot;_blank&quot; href=&quot;https://www.globenewswire.com/Tracker?data=zDoYeNGp2--D-qzKBTc0sAI_ofjoZSstYcp1i3dc3XqEQLJZx6MVV_EqIcuj0W5l1hPs2Ulw8mhHtNGtNaBVWoA7WUkKhD1OO8cpC76UfQgBNLP-Brliu5Xv9DjPyn5o&quot; rel=&quot;nofollow&quot; target=&quot;_blank&quot;&gt;Kopin Corporation&lt;/a&gt; (Nasdaq:KOPN) and is designed to address one of the largest emerging bottlenecks in artificial intelligence infrastructure: the movement of data between GPUs, accelerators, memory systems, and servers inside AI data centers.&lt;/p&gt;</description>
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