StreetInsider.com News Articles

Alphawave Semi Delivers Cutting-Edge UCIe™ Chiplet IP on TSMC 3DFabric® Platform

Wed, 01 Oct 2025 08:49:00 -0500

Provides 10x improvement in power efficiency and up to 5x increased signal density over traditional die-to-die interfaces

LONDON & TORONTO--(BUSINESS WIRE)-- Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, has announced the successful tape-out of its cutting edge UCIe™ 3D IP on the advanced TSMC SoIC® (SoIC-X) technology in the 3DFabric platform. This achievement builds on Alphawave Semi’s established baseline of leading UCIe™ IP subsystems and presents a significant evolution in the company’s chiplet integration capabilities. By leveraging TSMC’s SoIC-X advanced 3D packaging

Alphawave Semi Delivers Cutting-Edge UCIe™ Chiplet IP on TSMC 3DFabric® Platform

Wed, 01 Oct 2025 08:49:00 -0500

Provides 10x improvement in power efficiency and up to 5x increased signal density over traditional die-to-die interfaces

Alphawave Semi Delivers Cutting-Edge UCIe™ Chiplet IP on TSMC 3DFabric® Platform

Wed, 01 Oct 2025 08:49:00 -0500

Provides 10x improvement in power efficiency and up to 5x increased signal density over traditional die-to-die interfaces

Alphawave Semi Delivers Cutting-Edge UCIe™ Chiplet IP on TSMC 3DFabric® Platform

Wed, 01 Oct 2025 08:49:00 -0500

Provides 10x improvement in power efficiency and up to 5x increased signal density over traditional die-to-die interfaces

Alphawave Semi Brings Next-Generation Connectivity and Compute Innovations to ECOC 2025

Mon, 29 Sep 2025 05:02:00 -0500

Showcasing 224G XLR SerDes, 1.6T Multi-Standard I/O Chiplets, 36G UCIe D2D IP Subsystem, and 800G/1.6T PAM4 & Coherent-lite DSPs.

LONDON & TORONTO--(BUSINESS WIRE)-- Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, will showcase the latest advances in AI and connectivity IP at the European Conference on Optical Communication (ECOC) 2025.

Taking place this year at the Bella Center in Copenhagen, Denmark, ECOC is Europe’s leading optical communications conference, bringing together experts from academia, research, and industry. Building on the company’s previously announced DSP launch

Alphawave Semi Brings Next-Generation Connectivity and Compute Innovations to ECOC 2025

Mon, 29 Sep 2025 05:02:00 -0500

Showcasing 224G XLR SerDes, 1.6T Multi-Standard I/O Chiplets, 36G UCIe D2D IP Subsystem, and 800G/1.6T PAM4 & Coherent-lite DSPs.

Alphawave Semi Brings Next-Generation Connectivity and Compute Innovations to ECOC 2025

Mon, 29 Sep 2025 05:02:00 -0500

Showcasing 224G XLR SerDes, 1.6T Multi-Standard I/O Chiplets, 36G UCIe D2D IP Subsystem, and 800G/1.6T PAM4 & Coherent-lite DSPs.

Alphawave Semi Brings Next-Generation Connectivity and Compute Innovations to ECOC 2025

Mon, 29 Sep 2025 05:02:00 -0500

Showcasing 224G XLR SerDes, 1.6T Multi-Standard I/O Chiplets, 36G UCIe D2D IP Subsystem, and 800G/1.6T PAM4 & Coherent-lite DSPs.

Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity

Wed, 24 Sep 2025 08:00:00 -0500

Breakthrough Gen3 UCIe IP subsystem achieves 64 Gbps per-I/O pin data rates and doubles shoreline bandwidth density, enabling scalable XPUs, and data center chiplet architectures with TSMC’s 3nm process.

LONDON & TORONTO--(BUSINESS WIRE)-- Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, today announced the successful tapeout of the industry’s leading 64 Gbps UCIe™ die-to-die (D2D) IP subsystem on TSMC’s 3nm process technology. Building on its 36 Gbps Gen2 silicon success, this third-generation subsystem delivers a major advancement in performance and shoreline bandwidth density

Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity

Wed, 24 Sep 2025 08:00:00 -0500

Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity

Wed, 24 Sep 2025 08:00:00 -0500

Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity

Wed, 24 Sep 2025 08:00:00 -0500

Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes

Thu, 05 Jun 2025 06:51:00 -0500

First UCIe Die-to-Die IP Subsystem on TSMC’s 2nm Process with CoWoS® Advanced Packaging Technology Delivers 11.8 Tbps/mm Bandwidth Density and a Scalable Path for 64G Die to Die Interconnects

LONDON & TORONTO--(BUSINESS WIRE)-- Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, announced the successful tape out of one of the industry’s first UCIe™ IP subsystem on TSMC’s N2 process, supporting 36G die-to-die data rates. The solution is fully integrated with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS®) advanced packaging technology, unlocking breakthrough bandwidth density and scalability for next-generation

Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes

Thu, 05 Jun 2025 06:51:00 -0500

First UCIe Die-to-Die IP Subsystem on TSMC’s 2nm Process with CoWoS® Advanced Packaging Technology Delivers 11.8 Tbps/mm Bandwidth Density and a Scalable Path for 64G Die to Die Interconnects

Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes

Thu, 05 Jun 2025 06:51:00 -0500

First UCIe Die-to-Die IP Subsystem on TSMC’s 2nm Process with CoWoS® Advanced Packaging Technology Delivers 11.8 Tbps/mm Bandwidth Density and a Scalable Path for 64G Die to Die Interconnects

Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes

Thu, 05 Jun 2025 06:51:00 -0500

First UCIe Die-to-Die IP Subsystem on TSMC’s 2nm Process with CoWoS® Advanced Packaging Technology Delivers 11.8 Tbps/mm Bandwidth Density and a Scalable Path for 64G Die to Die Interconnects

Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks

Wed, 23 Apr 2025 08:30:00 -0500

Alphawave Semi’s platform of ready-to-integrate subsystem IP for 64G UCIe, 224G SerDes, 800G/1.6T UALink and UEC plus reference chiplet architecture designs will underpin future AI deployments

LONDON & TORONTO--(BUSINESS WIRE)-- Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, bolsters its leadership in foundational AI silicon connectivity subsystems through silicon proven chiplets and IP subsystems on advanced process nodes and package types. This is set to be showcased at the TSMC 2025 North America Technology Symposium.

This press release features multimedia. View the full

Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks

Wed, 23 Apr 2025 08:30:00 -0500

Alphawave Semi’s platform of ready-to-integrate subsystem IP for 64G UCIe, 224G SerDes, 800G/1.6T UALink and UEC plus reference chiplet architecture designs will underpin future AI deployments

This press release features multimedia. View the full

Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks

Wed, 23 Apr 2025 08:30:00 -0500

Alphawave Semi’s platform of ready-to-integrate subsystem IP for 64G UCIe, 224G SerDes, 800G/1.6T UALink and UEC plus reference chiplet architecture designs will underpin future AI deployments

This press release features multimedia. View the full

Alphawave Semi Delivers Foundational AI Platform IP for Scale-Up and Scale-Out Networks

Wed, 23 Apr 2025 08:30:00 -0500

Alphawave Semi’s platform of ready-to-integrate subsystem IP for 64G UCIe, 224G SerDes, 800G/1.6T UALink and UEC plus reference chiplet architecture designs will underpin future AI deployments

This press release features multimedia. View the full

Alphawave unveils new suite of optoelectronics Silicon products

Tue, 25 Mar 2025 09:05:24 -0500

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, has revealed its portfolio of optoelectronics products addressing the high-speed interconnect semiconductor market, which is forecast to exceed US$4-billion by 2028.