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   <title>Applied Materials to acquire NEXX advanced packaging unit from ASMPT</title>
   <link>http://www.streetinsider.com/Mergers+and+Acquisitions/Applied+Materials+to+acquire+NEXX+advanced+packaging+unit+from+ASMPT/26419678.html</link>
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&lt;p&gt;Applied Materials Inc. (NASDAQ: AMAT) announced it has entered into a definitive agreement to acquire the NEXX business from ASMPT Limited (HKEX: 0522). NEXX supplies large-area advanced packaging deposition equipment for the semiconductor industry.&lt;/p&gt;

&lt;p&gt;The acquisition will add NEXX's panel-level electrochemical deposition technology to Applied Materials' portfolio of panel-level advanced packaging technologies. These systems are designed for chipmakers developing larger AI accelerator packages that require more complex architectures.&lt;/p&gt;

&lt;p&gt;The semiconductor industry is transitioning from 300-millimeter silicon wafers to panel form factors as large as 510 by 515 millimeters to accommodate larger AI chip designs. These larger formats enable the integration of multiple</description>
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   <title>Applied Materials to acquire NEXX advanced packaging unit from ASMPT</title>
   <link>http://www.streetinsider.com/Mergers+and+Acquisitions/Applied+Materials+to+acquire+NEXX+advanced+packaging+unit+from+ASMPT/26419678.html</link>
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&lt;p&gt;Applied Materials Inc. (NASDAQ: AMAT) announced it has entered into a definitive agreement to acquire the NEXX business from ASMPT Limited (HKEX: 0522). NEXX supplies large-area advanced packaging deposition equipment for the semiconductor industry.&lt;/p&gt;

&lt;p&gt;The acquisition will add NEXX's panel-level electrochemical deposition technology to Applied Materials' portfolio of panel-level advanced packaging technologies. These systems are designed for chipmakers developing larger AI accelerator packages that require more complex architectures.&lt;/p&gt;

&lt;p&gt;The semiconductor industry is transitioning from 300-millimeter silicon wafers to panel form factors as large as 510 by 515 millimeters to accommodate larger AI chip designs. These larger formats enable the integration of multiple</description>
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   <title>Applied Materials to acquire NEXX advanced packaging unit from ASMPT</title>
   <link>http://www.streetinsider.com/Mergers+and+Acquisitions/Applied+Materials+to+acquire+NEXX+advanced+packaging+unit+from+ASMPT/26419678.html</link>
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&lt;p&gt;Applied Materials Inc. (NASDAQ: AMAT) announced it has entered into a definitive agreement to acquire the NEXX business from ASMPT Limited (HKEX: 0522). NEXX supplies large-area advanced packaging deposition equipment for the semiconductor industry.&lt;/p&gt;

&lt;p&gt;The acquisition will add NEXX's panel-level electrochemical deposition technology to Applied Materials' portfolio of panel-level advanced packaging technologies. These systems are designed for chipmakers developing larger AI accelerator packages that require more complex architectures.&lt;/p&gt;

&lt;p&gt;The semiconductor industry is transitioning from 300-millimeter silicon wafers to panel form factors as large as 510 by 515 millimeters to accommodate larger AI chip designs. These larger formats enable the integration of multiple</description>
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   <title>Applied Materials to acquire NEXX advanced packaging unit from ASMPT</title>
   <link>http://www.streetinsider.com/Mergers+and+Acquisitions/Applied+Materials+to+acquire+NEXX+advanced+packaging+unit+from+ASMPT/26419678.html</link>
   <description>

&lt;p&gt;Applied Materials Inc. (NASDAQ: AMAT) announced it has entered into a definitive agreement to acquire the NEXX business from ASMPT Limited (HKEX: 0522). NEXX supplies large-area advanced packaging deposition equipment for the semiconductor industry.&lt;/p&gt;

&lt;p&gt;The acquisition will add NEXX's panel-level electrochemical deposition technology to Applied Materials' portfolio of panel-level advanced packaging technologies. These systems are designed for chipmakers developing larger AI accelerator packages that require more complex architectures.&lt;/p&gt;

&lt;p&gt;The semiconductor industry is transitioning from 300-millimeter silicon wafers to panel form factors as large as 510 by 515 millimeters to accommodate larger AI chip designs. These larger formats enable the integration of multiple</description>
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   <title>Applied Materials to acquire NEXX advanced packaging unit from ASMPT</title>
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&lt;p&gt;Applied Materials Inc. (NASDAQ: AMAT) announced it has entered into a definitive agreement to acquire the NEXX business from ASMPT Limited (HKEX: 0522). NEXX supplies large-area advanced packaging deposition equipment for the semiconductor industry.&lt;/p&gt;

&lt;p&gt;The acquisition will add NEXX's panel-level electrochemical deposition technology to Applied Materials' portfolio of panel-level advanced packaging technologies. These systems are designed for chipmakers developing larger AI accelerator packages that require more complex architectures.&lt;/p&gt;

&lt;p&gt;The semiconductor industry is transitioning from 300-millimeter silicon wafers to panel form factors as large as 510 by 515 millimeters to accommodate larger AI chip designs. These larger formats enable the integration of multiple</description>
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   <title>Applied Materials to acquire NEXX advanced packaging unit from ASMPT</title>
   <link>http://www.streetinsider.com/Mergers+and+Acquisitions/Applied+Materials+to+acquire+NEXX+advanced+packaging+unit+from+ASMPT/26419678.html</link>
   <description>

&lt;p&gt;Applied Materials Inc. (NASDAQ: AMAT) announced it has entered into a definitive agreement to acquire the NEXX business from ASMPT Limited (HKEX: 0522). NEXX supplies large-area advanced packaging deposition equipment for the semiconductor industry.&lt;/p&gt;

&lt;p&gt;The acquisition will add NEXX's panel-level electrochemical deposition technology to Applied Materials' portfolio of panel-level advanced packaging technologies. These systems are designed for chipmakers developing larger AI accelerator packages that require more complex architectures.&lt;/p&gt;

&lt;p&gt;The semiconductor industry is transitioning from 300-millimeter silicon wafers to panel form factors as large as 510 by 515 millimeters to accommodate larger AI chip designs. These larger formats enable the integration of multiple</description>
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   <title>Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX</title>
   <link>http://www.streetinsider.com/Press+Releases/Applied+Materials+Broadens+Advanced+Packaging+Portfolio+with+Acquisition+of+NEXX/26419673.html</link>
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&lt;p&gt;SANTA CLARA, Calif., May  03, 2026  (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.&lt;/p&gt;  &lt;p&gt;Increasing AI workloads demand larger chiplet-based designs that integrate greater numbers of GPUs, high-bandwidth memory (HBM) stacks and</description>
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   <title>Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX</title>
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&lt;p&gt;SANTA CLARA, Calif., May  03, 2026  (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.&lt;/p&gt;  &lt;p&gt;Increasing AI workloads demand larger chiplet-based designs that integrate greater numbers of GPUs, high-bandwidth memory (HBM) stacks and</description>
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   <title>Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX</title>
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&lt;p&gt;SANTA CLARA, Calif., May  03, 2026  (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.&lt;/p&gt;  &lt;p&gt;Increasing AI workloads demand larger chiplet-based designs that integrate greater numbers of GPUs, high-bandwidth memory (HBM) stacks and</description>
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   <title>Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX</title>
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&lt;p&gt;SANTA CLARA, Calif., May  03, 2026  (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.&lt;/p&gt;  &lt;p&gt;Increasing AI workloads demand larger chiplet-based designs that integrate greater numbers of GPUs, high-bandwidth memory (HBM) stacks and</description>
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   <title>Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX</title>
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&lt;p&gt;SANTA CLARA, Calif., May  03, 2026  (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.&lt;/p&gt;  &lt;p&gt;Increasing AI workloads demand larger chiplet-based designs that integrate greater numbers of GPUs, high-bandwidth memory (HBM) stacks and</description>
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   <title>Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX</title>
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&lt;p&gt;SANTA CLARA, Calif., May  03, 2026  (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.&lt;/p&gt;  &lt;p&gt;Increasing AI workloads demand larger chiplet-based designs that integrate greater numbers of GPUs, high-bandwidth memory (HBM) stacks and</description>
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   <title>Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX</title>
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&lt;p&gt;SANTA CLARA, Calif., May  03, 2026  (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.&lt;/p&gt;  &lt;p&gt;Increasing AI workloads demand larger chiplet-based designs that integrate greater numbers of GPUs, high-bandwidth memory (HBM) stacks and</description>
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   <title>Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX</title>
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&lt;p&gt;SANTA CLARA, Calif., May  03, 2026  (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.&lt;/p&gt;  &lt;p&gt;Increasing AI workloads demand larger chiplet-based designs that integrate greater numbers of GPUs, high-bandwidth memory (HBM) stacks and</description>
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&lt;p&gt;SANTA CLARA, Calif., May  03, 2026  (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.&lt;/p&gt;  &lt;p&gt;Increasing AI workloads demand larger chiplet-based designs that integrate greater numbers of GPUs, high-bandwidth memory (HBM) stacks and</description>
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&lt;p&gt;SANTA CLARA, Calif., May  03, 2026  (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.&lt;/p&gt;  &lt;p&gt;Increasing AI workloads demand larger chiplet-based designs that integrate greater numbers of GPUs, high-bandwidth memory (HBM) stacks and</description>
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&lt;p&gt;SANTA CLARA, Calif., May  03, 2026  (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.&lt;/p&gt;  &lt;p&gt;Increasing AI workloads demand larger chiplet-based designs that integrate greater numbers of GPUs, high-bandwidth memory (HBM) stacks and</description>
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&lt;p&gt;SANTA CLARA, Calif., May  03, 2026  (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.&lt;/p&gt;  &lt;p&gt;Increasing AI workloads demand larger chiplet-based designs that integrate greater numbers of GPUs, high-bandwidth memory (HBM) stacks and</description>
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