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Form F-6EF KYOCERA CORP Filed by: JPMorgan Chase Bank, N.A. - ADR Depositary

Wed, 03 Jun 2026 11:34:00 -0400

si-local-file:///var/storage/secattach/20260603/26597356.html

Form F-6EF KYOCERA CORP Filed by: JPMorgan Chase Bank, N.A. - ADR Depositary

Wed, 03 Jun 2026 11:34:00 -0400

si-local-file:///var/storage/secattach/20260603/26597356.html

Form F-6EF KYOCERA CORP Filed by: JPMorgan Chase Bank, N.A. - ADR Depositary

Wed, 03 Jun 2026 11:34:00 -0400

si-local-file:///var/storage/secattach/20260603/26597356.html

Kyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors

Mon, 27 Apr 2026 14:00:00 -0400

To be shown at ECTC 2026, May 26-29 in Orlando; new substrate technology delivers superior rigidity and circuit miniaturization for next-gen data centers, AI, and ASIC packaging

KYOTO, Japan--(BUSINESS WIRE)-- Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) today announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs(1) and switch ASICs, which are rapidly scaling in complexity as AI data center architectures evolve. The new product will be unveiled at ECTC 2026, an international conference on semiconductor packaging technologies, in Orlando, Florida, USA, May 26-29, 2026.

This press release features

Kyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors

Mon, 27 Apr 2026 14:00:00 -0400

To be shown at ECTC 2026, May 26-29 in Orlando; new substrate technology delivers superior rigidity and circuit miniaturization for next-gen data centers, AI, and ASIC packaging

This press release features

Kyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors

Mon, 27 Apr 2026 14:00:00 -0400

To be shown at ECTC 2026, May 26-29 in Orlando; new substrate technology delivers superior rigidity and circuit miniaturization for next-gen data centers, AI, and ASIC packaging

This press release features

Kyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors

Mon, 27 Apr 2026 14:00:00 -0400

To be shown at ECTC 2026, May 26-29 in Orlando; new substrate technology delivers superior rigidity and circuit miniaturization for next-gen data centers, AI, and ASIC packaging

This press release features

Kyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors

Mon, 27 Apr 2026 14:00:00 -0400

To be shown at ECTC 2026, May 26-29 in Orlando; new substrate technology delivers superior rigidity and circuit miniaturization for next-gen data centers, AI, and ASIC packaging

This press release features

Kyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors

Mon, 27 Apr 2026 14:00:00 -0400

To be shown at ECTC 2026, May 26-29 in Orlando; new substrate technology delivers superior rigidity and circuit miniaturization for next-gen data centers, AI, and ASIC packaging

This press release features

Form 424B3 KYOCERA CORP

Thu, 26 Mar 2026 13:01:00 -0400

si-local-file:///var/storage/secattach/20260326/26222818.html

Form 424B3 KYOCERA CORP

Thu, 26 Mar 2026 13:01:00 -0400

si-local-file:///var/storage/secattach/20260326/26222818.html

Form 424B3 KYOCERA CORP

Thu, 26 Mar 2026 13:01:00 -0400

si-local-file:///var/storage/secattach/20260326/26222818.html

Kyocera Develops Pluggable Optoelectronic Module Supporting PCIe® 6.0, Contributing to High-Speed, Power-Efficient AI Data Centers

Tue, 10 Mar 2026 10:05:00 -0400

Product to be exhibited at OFC 2026 in AuthenX Booth #5204, Los Angeles, March 17–19

KYOTO, Japan--(BUSINESS WIRE)-- Kyocera Corporation (President: Hideo Tanimoto, hereinafter "Kyocera")(TOKYO:6971) is pleased to announce the development of a pluggable optoelectronic module (OSFP-XD*1) supporting the PCIe®*2 6.0 standard as a new product in its OPTINITY® optoelectronic module series, which contributes to optical communication implementation and power savings in data centers.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260309968307/en/

OPTINITY® OSFP-XD