http://www.streetinsider.com Latest StreetInsider.com News Articles en-us Copyright 2025, StreetInsider.com rss@streetinsider.com (SI RSS) rss@streetinsider.com (SI RSS) Wed, 03 Sep 2025 02:30:00 -0400 http://blogs.law.harvard.edu/tech/rss http://www.streetinsider.com/images/rss_logo.gif http://www.streetinsider.com 143 28 0 1 2 3 21 22 23 Saturday Sunday http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Press+Releases/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Business+Wire/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Business+Wire/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Business+Wire/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Business+Wire/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Business+Wire/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Business+Wire/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Business+Wire/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Business+Wire/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Business+Wire/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Business+Wire/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Business+Wire/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Business+Wire/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY http://www.streetinsider.com/Business+Wire/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html <p class="bwalignc"> <i>Industry-leaders will create hub for R&amp;D with prototype production line for 515 x 510mm panel-level organic interposers</i> </p> <p> TOKYO--(BUSINESS WIRE)-- Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semiconductor packaging technology that utilizes organic materials to create a bridge between different components on a circuit board—using a http://www.streetinsider.com/Business+Wire/Resonac+Launches+27-Member+%26quot%3BJOINT3%26quot%3B+Consortium+to+Develop+Next-Generation+Semiconductor+Packaging/25286897.html Wed, 03 Sep 2025 02:30:00 -0400 4004 A.04409796 A.08807109 A.26238511 A.29631941 A.37941400 A.42082292 A.42503122 A.50205434 O.00011206 O.00128806 O.00160617 O.00189078 O.00189332 O.00189611 O.05105736 O.29000909 SHWDY