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   <title>Form  4          ASE Technology Holding    For: Jun 01  Filed by: Uang Du-Tsuen</title>
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   <title>Form  4          ASE Technology Holding    For: Jun 01  Filed by: Uang Du-Tsuen</title>
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   <title>Form  4          ASE Technology Holding    For: Jun 01  Filed by: Uang Du-Tsuen</title>
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   <title>Form  SD         ASE Technology Holding               </title>
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   <title>Form  3/A        ASE Technology Holding    For: Mar 18  Filed by: Chung Chih-Hsiao</title>
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   <title>Form  3/A        ASE Technology Holding    For: Mar 18  Filed by: Chung Chih-Hsiao</title>
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   <title>Form  4          ASE Technology Holding    For: May 22  Filed by: Chen Jeffrey</title>
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   <title>ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation</title>
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&lt;p class=&quot;bwalignc&quot;&gt;
&lt;i&gt;Driving performance, scalability, and efficiency for next-generation compute workloads&lt;/i&gt;

&lt;/p&gt;
&lt;p&gt;    SUNNYVALE, Calif.--(BUSINESS WIRE)--
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to</description>
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   <title>ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation</title>
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&lt;p class=&quot;bwalignc&quot;&gt;
&lt;i&gt;Driving performance, scalability, and efficiency for next-generation compute workloads&lt;/i&gt;

&lt;/p&gt;
&lt;p&gt;    SUNNYVALE, Calif.--(BUSINESS WIRE)--
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to</description>
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&lt;p class=&quot;bwalignc&quot;&gt;
&lt;i&gt;Driving performance, scalability, and efficiency for next-generation compute workloads&lt;/i&gt;

&lt;/p&gt;
&lt;p&gt;    SUNNYVALE, Calif.--(BUSINESS WIRE)--
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to</description>
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   <title>ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation</title>
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&lt;p class=&quot;bwalignc&quot;&gt;
&lt;i&gt;Driving performance, scalability, and efficiency for next-generation compute workloads&lt;/i&gt;

&lt;/p&gt;
&lt;p&gt;    SUNNYVALE, Calif.--(BUSINESS WIRE)--
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to</description>
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   <title>ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation</title>
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&lt;p class=&quot;bwalignc&quot;&gt;
&lt;i&gt;Driving performance, scalability, and efficiency for next-generation compute workloads&lt;/i&gt;

&lt;/p&gt;
&lt;p&gt;    SUNNYVALE, Calif.--(BUSINESS WIRE)--
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to</description>
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   <title>ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation</title>
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&lt;p class=&quot;bwalignc&quot;&gt;
&lt;i&gt;Driving performance, scalability, and efficiency for next-generation compute workloads&lt;/i&gt;

&lt;/p&gt;
&lt;p&gt;    SUNNYVALE, Calif.--(BUSINESS WIRE)--
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to</description>
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&lt;i&gt;Driving performance, scalability, and efficiency for next-generation compute workloads&lt;/i&gt;

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&lt;p&gt;    SUNNYVALE, Calif.--(BUSINESS WIRE)--
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to</description>
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&lt;i&gt;Driving performance, scalability, and efficiency for next-generation compute workloads&lt;/i&gt;

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Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to</description>
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&lt;i&gt;Driving performance, scalability, and efficiency for next-generation compute workloads&lt;/i&gt;

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Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to</description>
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&lt;i&gt;Driving performance, scalability, and efficiency for next-generation compute workloads&lt;/i&gt;

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Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to</description>
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&lt;i&gt;Driving performance, scalability, and efficiency for next-generation compute workloads&lt;/i&gt;

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Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to</description>
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&lt;i&gt;Driving performance, scalability, and efficiency for next-generation compute workloads&lt;/i&gt;

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Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to</description>
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&lt;i&gt;Driving performance, scalability, and efficiency for next-generation compute workloads&lt;/i&gt;

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Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a leading provider of semiconductor assembly and test services, today announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to</description>
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