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FICG Strengthens ASEAN Presence Through Strategic Partnerships with AME and JTC

Fri, 31 Jul 2026 03:00:00 -0400

Establishes JS-SEZ Twinning Strategy to Advance Regional Manufacturing, Innovation and Supply Chain Integration

SINGAPORE, July 31, 2026 /PRNewswire/ -- As artificial intelligence (AI), high-performance computing (HPC), data centres and semiconductor technologies continue to accelerate global industrial transformation, manufacturers are reconfiguring their supply chains to enhance resilience, operational agility and responsiveness to customers across international markets.

Front Row, Left to Right: Dr Dylan Tan, CEO, AME Elite. Mr Steven Tan, President, PRO3C. Mr Nelson Liew, Group Director, New Estates, JTC. Back Row, Left to Right: Mr Frederick Chin, Head of Group Wholesale Banking
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<h1>FICG Strengthens ASEAN Presence Through Strategic Partnerships with AME and JTC</h1>
<p>Fri, 31 Jul 2026 03:00:00 -0400</p>
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Establishes JS-SEZ Twinning Strategy to Advance Regional Manufacturing, Innovation and Supply Chain Integration

Front Row, Left to Right: Dr Dylan Tan, CEO, AME Elite. Mr Steven Tan, President, PRO3C. Mr Nelson Liew, Group Director, New Estates, JTC. Back Row, Left to Right: Mr Frederick Chin, Head of Group Wholesale Banking
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<h1>FICG Highlights Advanced Packaging Integration for Optical Transceivers at APE 2026</h1>
<p>Tue, 03 Feb 2026 21:58:00 -0400</p>
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SINGAPORE, Feb. 3, 2026 /PRNewswire/ -- FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place February 4–6, 2026 at Sands Expo and Convention Centre, Singapore. At Booth A521, FICG will highlight its high-speed optical transceiver manufacturing and advanced packaging integration capabilities—enabling customers to address the accelerating demand for higher-bandwidth data center interconnect and improved energy efficiency driven by AI workloads.

FICG Highlights Advanced Packaging Integration for Optical Transceivers at APE 2026