BlackBerry (BBRY) Shares Some iPhone, Galaxy S III Components (AAPL) (AVGO) (QCOM)
iFixit did a tear down of the BlackBerry (Nasdaq: BBRY) Z10 smartphone, revealing some of the key components inside. Some notable chips include:
* Samsung KLMAG2GE4A 16 GB MLC NAND Flash + Controller;
* Avago (Nasdaq: AVGO) ACPM-7051 Quand-Band GSM/EDGE, Dual-Band UMTS (B1/B5) Power Amplifier, and ACPM-5017 LTE Band XVII Power Amplifier;
* ST Microelectronics (NYSE: STM) LIS3DH 3-axis MEMS Accelerometer and LSM330DLC 3D Accelerometer & 3D Gyroscope;
* Samsung K3PE0E000A XG 2 GB Mobile DDR2 SDRAM + Qualcomm MSM8960 Snapdragon S4 Baseband/Applications Processor;
* Qualcomm (Nasdaq: QCOM) PM8921 Power Management IC and RTR8600 Multi-band/mode RF transceiver, the same one found in the Samsung Galaxy S III and Apple's (Nasdaq: AAPL) iPhone 5, and WCD9310 Audio Codec;
* Texas Instruments (Nasdaq: TXN) WL1273L Wireless Module (802.11a/b/g/n, WLAN, Bluetooth, and FM);
* TriQuint (Nasdaq: TQNT) TQP6M9017 Dual-Band WLAN Module; and
* RF Micro Devices (Nasdaq: RFMD) RF7252 Linear Power Amplifier Module.
For the complete manual, click here.
* Samsung KLMAG2GE4A 16 GB MLC NAND Flash + Controller;
* Avago (Nasdaq: AVGO) ACPM-7051 Quand-Band GSM/EDGE, Dual-Band UMTS (B1/B5) Power Amplifier, and ACPM-5017 LTE Band XVII Power Amplifier;
* ST Microelectronics (NYSE: STM) LIS3DH 3-axis MEMS Accelerometer and LSM330DLC 3D Accelerometer & 3D Gyroscope;
* Samsung K3PE0E000A XG 2 GB Mobile DDR2 SDRAM + Qualcomm MSM8960 Snapdragon S4 Baseband/Applications Processor;
* Qualcomm (Nasdaq: QCOM) PM8921 Power Management IC and RTR8600 Multi-band/mode RF transceiver, the same one found in the Samsung Galaxy S III and Apple's (Nasdaq: AAPL) iPhone 5, and WCD9310 Audio Codec;
* Texas Instruments (Nasdaq: TXN) WL1273L Wireless Module (802.11a/b/g/n, WLAN, Bluetooth, and FM);
* TriQuint (Nasdaq: TQNT) TQP6M9017 Dual-Band WLAN Module; and
* RF Micro Devices (Nasdaq: RFMD) RF7252 Linear Power Amplifier Module.
For the complete manual, click here.