Nvidia (NASDAQ: NVDA) announced plans with several supply chain partners to expand global manufacturing capacity across substrates, advanced packaging, semiconductor testing, and optical engines, according to a company press release issued at GTC Berlin on Oct. 21, 2026.

Substrate agreements with IBIDEN, Samsung Electro-Mechanics, and Unimicron Technology Corporation are targeted to collectively drive a 2.5x increase in substrate capacity over the next three years. IBIDEN's expansion at its Ono Plant in Japan, supported by a multibillion-dollar capacity reservation advance from Nvidia, targets capacity reaching 3x current levels, with additional capacity expected to begin ramping in the first quarter of 2028. Unimicron's expansion in Taiwan is expected to begin adding capacity in the second quarter of 2027 and reach full capacity by mid-2028.

Amkor Technology plans to increase advanced packaging capacity in South Korea by more than 300% by the end of 2028 to support Nvidia's current and next-generation platforms.

Nvidia issued a $1.1 billion capacity reservation advance to King Yuan Electronics (KYEC) to support new semiconductor testing facilities in the U.S., with high-volume production targeted for April 2027. Nvidia said its total semiconductor testing capacity is expected to double from 2026 to 2027, with additional buildouts in Taiwan and Singapore. Expanded testing operations in Singapore are expected to begin high-volume production in February 2027.

Siliconware Precision Industries (SPIL) is targeting a 15x increase in optical-engine capacity for co-packaged optics by mid-2027, with an additional doubling targeted by the end of 2028.

"Demand is extraordinary. Capacity is the constraint," said Jensen Huang, founder and CEO of Nvidia, in the statement.