Super Micro Computer, Inc. (NASDAQ: SMCI) announced an expanded portfolio of Open Compute Project Accepted systems, racks, and rear door heat exchangers on Oct. 13, 2026, ahead of the OCP Global Summit in San Jose, California.

The portfolio includes ORv3 and ORW racks with integrated 48V DC busbars, in-rack cooling distribution units, rear door heat exchangers ranging from 10 kW to 120 kW, networking switches, and system management software. The company said the solutions are designed to work together as complete rack-scale deployments under its Data Center Building Block Solutions (DCBBS) framework.

Specific hardware announced includes a 2U node supporting up to 144 Nvidia HGX B300 GPUs per rack, support for Nvidia's Vera Rubin NVL72 platform, a 250 kW 4U in-rack cooling distribution unit, and a 2U co-packaged optics switch delivering 102.4 Tbps across 128 ports. The company also said it will include Nvidia Spectrum-X Ethernet Photonics switch systems in the DCBBS portfolio, which Nvidia describes as built on 102.4 Tb/s Spectrum-6 Ethernet silicon.

The ORv3 and ORW rack series replace per-server power supplies with a centralized busbar, and Supermicro's DLC-2 direct-to-chip liquid cooling is designed to remove heat from CPUs and GPUs. Two propylene glycol coolants, DLC-1 and DLC-2, are offered for different rack cooling configurations.

"By integrating compute, networking, power, advanced cooling, software, and services into validated rack-scale solutions, we help customers simplify complexity and accelerate the path from innovation to production," said Charles Liang, president and CEO of Supermicro.

Dirk Van Slyke, vice president of marketing at OCP, said the combined solutions are intended to help customers manage integration and facility capacity for AI infrastructure deployments.

Supermicro is displaying the portfolio at OCP Global Summit booth #B4, running through Oct. 15 in San Jose.