nVent (NYSE: NVT) and AMD announced a collaboration to integrate rack-level cooling into the AMD Helios Rackscale solution, combining nVent's rear door heat exchanger (RDHx) technology with AMD's AI infrastructure platform.

The AMD Helios platform includes AMD Instinct GPUs, EPYC CPUs, Pensando networking technologies, and the AMD ROCm open software stack. nVent's DC-powered RDHx is designed as a dual rear door unit built for the double-wide AMD Helios rack, capturing residual heat from direct-to-chip liquid cooling and returning cooled air to the surrounding space.

The RDHx features integrated air temperature and humidity sensors, differential pressure fan speed control, and DC power compatibility. According to the companies, the design allows operators to begin with a single rack and scale deployments over time.

"The rack, not any single component within it, has now become the unit of deployment; and compute, networking, software, power and cooling must operate as one system," said Ravi Pendekanti, corporate vice president, Data Center Solutions Business Group, AMD.

Eric Osborn, vice president and general manager of Data Solutions, Cooling & Power at nVent, said the companies worked closely to ensure compatibility with the platforms customers are building on.

The two companies unveiled a first look at the solution at the OCP Global Summit in San Jose, California, held October 12–16, 2026, where the RDHx was displayed on an Open Rack Wide rack alongside manifolds, bus bars, and power shelves from a Helios deployment.