Texas Instruments (NASDAQ: TXN) introduced three new semiconductor products at the Open Compute Project Global Summit in San Jose, Calif., targeting power monitoring, high-voltage delivery, and signal timing in AI data centers.

The ADC34DSO75 is a 3 gigasamples per second analog-to-digital converter that the company claims is the highest performance device of its kind. The chip enables continuous, event-based remote monitoring of power rails at nanosecond resolution, which Texas Instruments says is thousands of times faster than current monitoring solutions. The device includes on-chip digital signal processing and is intended to detect transient power faults without requiring on-site equipment such as oscilloscopes.

The LMI800PS is described by the company as the first 800V isolated hot-swap controller on the market. It consolidates functions previously requiring five separate integrated circuits into a single package, reducing board area by more than 60%, according to the company. The device supports both ±400V and 800V power distribution and meets 5kVrms reinforced isolation standards.

The LMK6B is a bulk acoustic wave-based oscillator with a jitter specification of 9.6 femtoseconds at 625MHz, aimed at supporting data transmission rates approaching 3.2 terabits per second in networking infrastructure.

"As AI workloads drive massive scale, the need for real-time visibility and architectural stability has never been greater," said Karthik Vasanth, vice president and general manager for TI's Data, Converters and Clocks business unit.

All three products were demonstrated at the OCP Global Summit, where Texas Instruments occupied booth No. E45. The company also announced that power electronics engineer David Reusch will present a session on 800V data center design on Oct. 15 at the summit.