TTM Technologies, Inc. (NASDAQ: TTMI) announced a $400 million investment plan to expand capacity across four facilities in China and its plant in Penang, Malaysia, according to a company press release dated Oct. 12, 2026.

The planned investment is incremental to a previously disclosed commitment to invest $1.2 billion through the 2025-2029 timeframe. The expansion is focused on scaling the company's advanced printed circuit board and interconnect manufacturing capabilities to meet demand from data center infrastructure providers, hyperscalers, and networking customers.

Rather than constructing new facilities, TTM said it will use a "brownfield" approach, optimizing existing operational space and adding new equipment to bring AI-specific PCB production online more quickly.

"The rapid growth in demand requires us to make rapid capacity increases across several of our facilities," said Edwin Roks, President and CEO of TTM. Jim Walsh, Chief Operating Officer, added that leveraging the company's existing footprint in China and Penang is intended to shorten the time between investment and revenue generation.

TTM said it plans to provide additional detail to investors during its Third Quarter 2026 Earnings Conference call, with the date to be announced in coming weeks.