Lumentum Holdings (NASDAQ: LITE), Astera Labs (NASDAQ: ALAB), and Corning Incorporated (NYSE: GLW) announced a joint demonstration of PCIe-over-optics connectivity for AI rack-scale architectures at the 2026 OCP Global Summit in San Jose, California, running October 12–15.

The rack-level demonstration combines Astera Labs' Scorpio Smart Fabric Switch, Lumentum's 1060 nm VCSEL-based optical interconnect platform, and Corning multimode fiber connectivity. It is on display at Astera Labs booth #B34.

The proof-of-concept system is designed to demonstrate multiple 32 Gb/s NRZ optical channels over Corning multimode fiber and an error-free PCIe-5 link. The optical interconnect uses high-density VCSEL and photodetector arrays with two-dimensional arrays and backside lens technology, built on Lumentum's manufacturing platform used in 3D sensing for smartphone devices.

According to the companies, the architecture is designed to address reach, cable density, signal integrity, power, and thermal constraints associated with conventional electrical interconnects in rack-scale AI systems.

"AI infrastructure is pushing optical connectivity closer to the compute system where reach, density, and power represent significant challenges," said Matt Sysak, Chief Technology Officer at Lumentum. "This demonstration with Astera Labs and Corning shows how Lumentum's 1060 nm VCSEL platform can extend PCIe connectivity and unlock a whole new class of functionality."

"As AI clusters scale to unprecedented levels, we are breaking the constraints of single rack-level architectures," said Adit Narasimha, Senior Vice President of the Signal Connectivity Group at Astera Labs.

"As optical links move closer to compute devices, fiber connectivity must support increasing density, precision, and scalability," said Claude Echahamian, Vice President and General Manager of Emerging Businesses and EMEA at Corning Optical Communications.