MicroVision, Inc. (NASDAQ: MVIS) announced that its wholly owned subsidiary Scantinel has introduced an external laser small form-factor pluggable (ELSFP) module designed for co-packaged optics systems in AI data centers and cloud infrastructure.

The announcement was made as the global photonics community gathered in Málaga, Spain for the 52nd European Conference on Optical Communication and the Global Photonics Economic Forum.

Scantinel's ELSFP module is built around a photonic integrated circuit (PIC), a two-dimensional photonics platform intended to improve speed, power efficiency, and economics of high-speed optical connectivity. The module centralizes and optimizes the laser source used for high-speed optical connections, with an architecture designed to reduce complexity and power consumption.

MicroVision Chief Executive Officer Glen DeVos said the PIC technology in the module is the same core technology used in the company's FMCW lidar architecture. "Since acquiring Scantinel, our team has continued to refine and validate this technology," DeVos said. "Its application to AI data center connectivity and photonics-enabled cloud computing demonstrates the broader value of that acquisition."

The Redmond, Washington-based company said it is currently in discussions with potential licensees and development partners as it evaluates channels to commercialize the technology. MicroVision described the photonics introduction as part of a broader expansion into intelligent infrastructure applications.