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Coherent to display optical tech for AI infrastructure at ECOC 2026

September 20, 2026 8:45 PM

Coherent Corp. (NYSE: COHR) is presenting new optical technologies and live demonstrations at the European Conference on Optical Communication (ECOC) 2026 in Málaga, Spain, from September 21–23, at Stand 2100, Hall 2.

The company is showcasing a range of products and demonstrations targeting AI datacenter connectivity, co-packaged optics (CPO), near-packaged optics (NPO), pluggable transceivers, optical transport, specialty fibers, optical circuit switching, advanced materials, and thermal management.

Among the featured demonstrations is a 3.2T pluggable transceiver in an OSFP-size package with dual 1.6T optical paths and eight 425G PAM4 line-side optical lanes. Coherent is also demonstrating a 6.4T NPO optical engine combining silicon photonics, fiber attach technology, ELSFPs, and laser technology, as well as high-density 2D VCSEL and photodiode arrays for CPO and NPO architectures.

Coherent introduced PhotonLink, described as an integrated optics platform combining CPO, NPO, and chip-to-chip connectivity capabilities. The company said additional details will be announced separately.

"Scaling AI infrastructure requires more than bandwidth – it requires solving power, integration and thermal challenges together," said Dr. Sanjai Parthasarathi, Chief Marketing Officer at Coherent.

The company is also presenting its LS200 full C-band pluggable optical line system for datacenter interconnect applications and Thermadite diamond-based materials for thermal management in high-density AI infrastructure.

Coherent will participate in quantum technology demonstrations with two partners. With Quside, the company will demonstrate quantum random number generation for encryption. With CUbIQ, it will demonstrate quantum key distribution in a compact pluggable architecture.

Company executives are scheduled to speak across multiple Market Focus sessions and technical program events at ECOC between September 20 and September 24, covering topics including co-packaged optics, AI interconnect scaling, advanced materials, and satellite connectivity.

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