Investing.com -- Broadcom Inc. is negotiating with a group of lenders to secure more than $60 billion in debt financing for an artificial intelligence chip deal that would support Anthropic PBC and other companies, Bloomberg reported Thursday citing people familiar with the matter.

The financing package, which remains under discussion, may include an additional junior debt tranche of approximately $30 billion, the report said.

Broadcom would reportedly guarantee part of the senior-secured tranche under the proposed arrangement, which could total between $60 billion and $70 billion. The figures being discussed could bring the overall financing to as much as $100 billion.

The agreement would join a series of deals focused on funding artificial intelligence infrastructure. AI companies such as Anthropic, which created the Claude platform, are taking a larger role in building computing capacity. Broadcom aims to increase sales of chips and data center equipment as it competes with Nvidia Corp. in this market.

Blackstone Inc. and Apollo Global Management are in discussions with Broadcom to join the chip financing, building on a partnership the three companies formed in June to fund computing infrastructure. A special-purpose vehicle would issue the debt, the report added.

The deal would provide companies including Anthropic with access to chips and other essential AI infrastructure. The structure could resemble the $35 billion debt agreement that launched the group's AI XPV partnership.

Discussions continue and terms may change. The financing could be distributed in stages rather than as a single transaction.