Coherent Corp. (NYSE: COHR) has begun distributing samples of its 300mm high thermal conductivity silicon carbide (SiC) substrates to AI semiconductor partners, the company announced Aug. 17, 2026.

The substrates are designed for use as heat spreaders and related packaging components in AI processors and high-performance computing systems. According to the company, the material is engineered to improve heat spreading by up to 25% compared to current solutions, while remaining compatible with existing semiconductor manufacturing platforms.

Coherent states its SiC production process is vertically integrated, covering crystal growth, wafering, polishing, and characterization. The company said the move to customer sampling shifts the 300mm platform from internal development to external evaluation across the AI semiconductor ecosystem.

"AI performance is increasingly constrained by the industry's ability to remove heat from next-generation processors," said Craig Mullaney, Senior Vice President and General Manager at Coherent. "Advanced SiC thermal management materials can play an important role in addressing that challenge."

Coherent, founded in 1971 and headquartered in Saxonburg, Pa., operates in more than 20 countries.