Schneider Electric and AMD announced a jointly developed and validated reference design for the AMD Helios rackscale solution, according to a press release issued July 23, 2026.

The reference design supports high-density AI workloads up to 246 kW per rack and modular AI clusters of up to 10.4 MW IT load for greenfield deployments. The AMD Helios platform is powered by AMD Instinct MI455X GPUs, 6th Gen AMD EPYC CPUs, AMD Pensando Vulcano NICs, and the open ROCm software ecosystem.

The design covers four technical areas: facility power, facility cooling, IT space, and lifecycle software. It incorporates advanced liquid cooling using Motivair by Schneider Electric CDU-based and hybrid air/liquid approaches capable of removing up to 84% of heat, and is designed to achieve a power usage effectiveness (PUE) as low as approximately 1.12 at full load.

Electrical and thermal performance was validated using ETAP and EcoStruxure IT Design CFD simulation tools. The reference design also includes Integrated Electrical Digital Twin capabilities and support from AVEVA's Unified Operations Center for real-time monitoring.

"Through our collaboration with AMD, we're delivering an engineering-backed reference design that bridges the gap between advanced AI compute platforms, energy tech, and real-world data center implementation," said Manish Kumar, Executive Vice President, Secure Power & Data Centers at Schneider Electric.

Forrest Norrod, Executive Vice President and General Manager of AMD's Data Center Solutions Business Group, said the collaboration gives "customers a practical blueprint to accelerate high-density AI deployments, reduce integration risk and scale with greater confidence and efficiency."

The reference design has been validated to ANSI standards for U.S. deployments, with plans to extend support to IEC standards for international use. The companies described this release as the first milestone of their collaboration.