Arteris, Inc. (Nasdaq: AIP) announced that Speedata has deployed Arteris FlexNoC interconnect technology in its Callisto Analytics Processing Unit (APU), according to a press release from Arteris.

Speedata's Callisto APU is designed to run Apache Spark SQL, AI data preparation, agentic analytics, and batch ETL workloads natively in silicon. Speedata says the APU delivers up to 100x faster performance and 90% lower total cost of ownership compared to general-purpose compute, with no code changes required.

Arteris FlexNoC serves as the on-chip interconnect in the Callisto design, linking compute, memory, and I/O components across the processor. Speedata said the technology will also be used in its next-generation Andromeda APU.

"Arteris FlexNoC has been an important enabling technology across both Callisto and our next-generation Andromeda APU, giving our engineering teams the flexibility to focus on innovation in accelerated data analytics while relying on a proven interconnect foundation," said Rafi Shalom, CTO, chief architect, and co-founder of Speedata.

K. Charles Janac, president and CEO of Arteris, said moving data efficiently has become as important as processing it. "Speedata has developed an innovative approach to data analytics acceleration, and we're pleased our technology is helping enable that vision," he said.

Speedata claims that in one enterprise AI data preprocessing deployment, its APU allowed customers to replace 37 servers with three units.