Super Micro Computer, Inc. (NASDAQ: SMCI) announced July 15 the expansion of its Rear Door Heat Exchanger (RDHx) portfolio, adding ten models with cooling capacities ranging from 10kW to 120kW per door and up to 240kW at the rack level.

The RDHx units are compatible with standard EIA, ORv3, and MGX racks and can be deployed in new data centers or retrofitted into existing facilities without requiring dedicated chilled water infrastructure or major facility modifications.

The portfolio can function as a standalone liquid cooling solution or be paired with Supermicro's Direct-to-Chip liquid cooling technology as part of its Data Center Building Block Solutions (DCBBS) offering. Both AC- and DC-powered models are available, with the DC variants designed to integrate with rack busbars.

"Our expanded RDHx portfolio helps customers realize the benefits of liquid cooling, with a range from 10kW up to 120kW of cooling at the door level, with a max of 240kW of cooling capacity at the rack-level, enabling more efficient data center operations," said Charles Liang, president and CEO of Supermicro.

The units include features such as intelligent fan control, N+1 redundancy, and anti-condensation protection. Monitoring is supported via Redfish, SNMP, web-based management, and Supermicro's SuperCloud Composer software.

According to the company's press release, the RDHx solutions can be bundled with accelerated systems, rack-scale integration, facility power and cooling, management software, and deployment services under the DCBBS framework.