Applied Materials, Inc. (Nasdaq: AMAT) introduced six new chipmaking systems on June 25, 2026, targeting DRAM manufacturing and advanced packaging processes used in AI chip production.

The company unveiled an enhanced Centura Prime Epi epitaxy system for DRAM fabs that selectively grows doped silicon germanium and silicon phosphorous in transistor source and drain regions. The system features a 20% smaller footprint compared to its predecessor, which Applied says enables higher tool density in DRAM facilities.

Three new advanced packaging systems were also announced. The Opta Quad CMP platform is designed for chemical mechanical planarization in advanced packaging, monitoring wafer conditions during polishing and adjusting in real time. The Nokota VMax 2 electrochemical deposition system introduces a feature called Adaptive Pattern Tuning, which dynamically shapes the electric field during copper plating to improve uniformity across the wafer. The Producer Avila 2 PECVD system deposits stress-balanced dielectric films around through-silicon vias to address warpage in thinned DRAM dies used in high bandwidth memory stacks.

Two new electron beam systems round out the announcement. The VeritySEM 7AP offers critical dimension metrology with sub-10nm sensitivity for advanced packaging substrates. The SEMVision G7AP defect analysis system is already in production at memory and logic manufacturers, according to the company.

"The transistor and materials technologies that drove performance gains in leading-edge logic are now becoming essential in DRAM," said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials.

Applied Materials is based in Santa Clara, California, and the announcements were made in conjunction with a DRAM and Advanced Packaging Master Class event held the same day.