TTM Technologies, Inc. (NASDAQ: TTMI) opened a new Ultra-High-Density Interconnect (Ultra-HDI) printed circuit board manufacturing facility in Syracuse, New York, according to a company press release.

The 215,000-square-foot facility, built on TTM's existing Syracuse campus, represents a $130 million investment in domestic defense electronics production. Of that total, $30 million came from the U.S. Department of Defense, which recognized the facility's strategic importance to national security.

The facility is intended to support aerospace and defense programs, including radar systems, missile defense, space-based sensors, and autonomous systems. TTM describes it as among the first in the nation purpose-built for Ultra-HDI PCB and advanced packaging production serving those markets.

The investment is expected to create up to 400 new engineering and manufacturing jobs, bringing TTM's total Central New York workforce to approximately 1,000 employees.

"Our defense customers need trusted, domestic, ultra-high-density interconnect production capability that meets the most demanding program requirements in the world," said Cathie Gridley, EVP and President of Aerospace & Defense at TTM Technologies. "This investment strengthens the U.S. microelectronics supply chain, deepens our commitment to Central New York, and positions TTM to support the next generation of defense and national security technologies for decades to come."

The project was first announced in November 2023. A beam-signing ceremony attended by New York Governor Kathy Hochul took place in October 2024. TTM has maintained a manufacturing presence in Syracuse for more than 60 years.