Qnity Electronics Inc. (NYSE: Q) announced the introduction of two advanced packaging materials designed for organic interposer applications. The company released Intervia 8540HSP multi-role copper and Cyclotene DF6800M dry film photo-imageable dielectric materials.

The Intervia 8540HSP copper targets AI-driven GPU applications, providing metallization for micro-bump and copper redistribution layer applications. The material offers controlled surface variation and high-purity copper deposition for fine-pitch interconnect formation in semiconductor devices.

The Cyclotene DF6800M serves as a dry film dielectric for glass core substrates and glass interposers. The material supports fine-feature patterning and multilayer build-up processes for semiconductor manufacturing through its photo-imageable, aqueous-developed chemistry.

"AI is fundamentally changing how chips are packaged—and materials have to evolve just as fast," said Chuck Xu, President of Interconnect Solutions at Qnity. "As architectures move from shrinking to stacking, we're focused on enabling that shift with advanced materials that give our customers a clear edge in performance, yield, and long-term reliability."

Both materials are designed to support advanced interconnect formation, redistribution layer designs, and glass-based substrate structures across wafer-level packaging, panel-level packaging, and thermal assembly applications.

Qnity will display the materials at booth 2C-47 during the JPCA Show 2026, scheduled for June 10-12 at Tokyo Big Sight. The information is based on a company press release.