Wolfspeed Inc. (NYSE: WOLF) announced the introduction of two new 3.3 kV silicon carbide power module families designed for energy infrastructure applications including AI data centers and renewable energy systems.

The company launched high-power half-bridge baseplate modules and scalable full-bridge baseplate-less modules in industry-standard footprints. The half-bridge baseplate module targets applications exceeding 800 amperes and is designed for solar, grid-scale energy storage, and wind-power infrastructure. The full-bridge baseplate-less module, part of the WolfPACK family, is engineered for solid-state transformers and modular renewable energy infrastructure.

Both module families use Gen 4 technology and are designed for continuous operation in 2 kV and higher DC-link architectures. The modules feature sintered die attach technology and are engineered for 24/7 operation requirements.

According to the company, the high-power baseplate module delivers up to 42% improvement in switching losses compared to other silicon carbide solutions available in the market and more than 90% improvement over IGBTs when measured at 125°C on a 1.8 kV bus in the same package.

"The release of this 3.3 kV MOSFET voltage node in two complementary footprints was a strategic decision," said Guy Moxey, vice president of Wolfspeed's Industrial & Energy business. "We understand the urgency our customers are facing to scale power infrastructure."

Samples for the IBB020A33GM4, IBB020A33GM4T, and HAB900C33LM4 modules are available for select customers through Wolfspeed's direct sales representatives. The company will demonstrate both families at PCIM from June 9-11, 2026, at booth 7-435.

The information is based on a company press release.