AMD (NASDAQ: AMD) announced more than $10 billion in investments across Taiwan's technology ecosystem to expand partnerships and scale advanced packaging capabilities for AI infrastructure, according to a company statement.

The investment focuses on developing advanced packaging technologies, including industry-leading EFB-based 2.5D packaging for AMD's 6th generation EPYC CPUs codenamed "Venice." The company is collaborating with Taiwan-based partners ASE and SPIL to develop next-generation wafer-based 2.5D bridge interconnect technology.

AMD achieved a milestone with PTI by qualifying what it describes as the industry's first 2.5D panel-based EFB interconnect technology. The company states this technology supports high-bandwidth interconnect at scale for more efficient AI systems.

The investments support the planned deployment of AMD's Helios rack-scale platform in the second half of 2026. The platform will feature AMD Instinct MI450X GPUs and 6th generation AMD EPYC CPUs. Manufacturing partners include Sanmina, Wiwynn, Wistron and Inventec.

"As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand," said Dr. Lisa Su, AMD's chair and CEO.

Additional Taiwan partners involved in the initiative include Unimicron Technology Corp, AIC, Nan Ya PCB and Kinsus, which will provide substrate solutions and mechanical architecture support.

The announcement represents AMD's strategy to combine silicon innovation with manufacturing partnerships to address increasing demand for AI computing infrastructure. The company's approach builds on existing capabilities in chiplet architectures and high-bandwidth memory integration.