Amkor Technology Inc. (NASDAQ: AMKR) announced it has acquired an additional 67-acre parcel adjacent to its existing Arizona manufacturing campus in Peoria's Innovation Core. The acquisition expands the company's total land holdings to 171 acres at the site.

The semiconductor packaging and test services company is developing the campus to support advanced packaging and test capabilities. Amkor previously announced plans for what it describes as the first high-volume advanced packaging OSAT facility in the United States at the Arizona location.

The facility targets markets including artificial intelligence, high-performance computing, automotive, and communications applications. The company's existing campus sits on 104 acres designed for large-scale semiconductor packaging and test operations.

"Amkor's investment in Arizona represents a significant step in building advanced semiconductor manufacturing capacity in the United States," said Kevin Engel, president and chief executive officer. "Our continued expansion in Arizona strengthens our ability to support customers with leading-edge packaging and test solutions while contributing to a more resilient global supply chain."

The additional land purchase provides strategic flexibility for future expansion as customer demand evolves, according to the company's statement. Amkor bills itself as the world's largest U.S.-headquartered outsourced semiconductor assembly and test provider.

The company operates facilities across multiple countries and provides services including advanced packaging, wafer-level processing, and system-in-package solutions for applications in smartphones, data centers, automobiles and wearable devices.