Quantum Cyber N.V. (NASDAQ: QUCY) filed a non-provisional utility patent application with the United States Patent and Trademark Office for an electromagnetic pulse shielding composite filament designed for 3D printing drone enclosures and electronics housings.

The patent application describes a multi-component thermoplastic filament composed of a PETG polymer matrix combined with aluminum flake, carbonyl iron powder, carbon black, and milled carbon fiber. The filament is formulated for use in standard fused deposition modeling 3D printers and produces printed enclosures that achieve broadband shielding effectiveness of 35 to 55 dB across frequencies from 10 kHz to 10 GHz, according to ASTM D4935 measurements.

The company stated the filament is designed for use with commercially available desktop 3D printers, enabling production of EMP-hardened drone enclosures at the unit level. Quantum Cyber positions this as an alternative to metallic Faraday enclosures or conductive gaskets, which the company says impose weight and manufacturing complexity incompatible with modern unmanned aerial vehicle constraints.

"EMP hardening has been a known gap in drone defense for years, and every military deploying drone swarms is exposed to it," said David Lazar, Chief Executive Officer of Quantum Cyber. "We have developed a real, manufacturable solution using standard 3D printing equipment and commercially available materials."

The company indicated it intends to integrate this technology across its developing System-of-Systems portfolio for drone warfare, counter-unmanned aircraft systems, and border security applications.

Quantum Cyber noted in its forward-looking statements that filing a non-provisional patent application does not guarantee patent issuance by the USPTO.