United Microelectronics Corporation (NYSE: UMC) announced the release of its 14nm embedded high-voltage FinFET technology platform for display driver integrated circuits. The process design kit is now available for customer designs and has been validated at the company's Fab 12A facility.

The 14nm eHV FinFET platform delivers up to 40% reduction in power consumption and 35% reduction in chip area compared to UMC's existing 22nm process. The technology replaces planar transistors with FinFET devices in digital circuitry and includes optimized input/output devices for enhanced electrical performance.

The platform supports higher refresh rates for high-resolution display applications and enables longer battery life in smartphones through improved power efficiency. The technology also allows for thinner driver modules in premium smartphone models.

"This new 14nm eHV platform marks a major step forward as we bring FinFET technology to display drivers for the first time," said Steven Hsu, Vice President of Technology Development at UMC.

UMC operates as a semiconductor foundry serving the display driver IC market. The company currently offers what it describes as the most advanced 22nm display driver IC solution in production. The new 14nm platform extends UMC's high-voltage process solutions, which span from 0.6µm to 14nm nodes.

The Taiwan-based company operates 12 fabrication facilities with combined monthly capacity exceeding 400,000 wafers on a 12-inch equivalent basis. UMC employs approximately 20,000 people worldwide across facilities in Taiwan, Asia, the United States, and Europe.