Ceva Inc. (NASDAQ: CEVA) announced a design win with a U.S. semiconductor company for its Bluetooth High Data Throughput platform that includes the company's internally developed RF technology.

The customer had previously licensed Ceva's Bluetooth IP portfolio and has now adopted the integrated platform combining digital baseband, software stack and RF technology. This marks a progression from component-level IP licensing to system-level wireless solutions.

The design win reflects two developments in Ceva's business: Bluetooth 6.0 designs entering production with royalties beginning to ramp, and early Bluetooth HDT design wins positioning the company for high-performance wireless devices.

"Securing this major Bluetooth HDT design win including our integrated RF technology is a pivotal milestone for Ceva," said Amir Panush, Chief Executive Officer of Ceva. "Our deliberate investment in RF technology, including targeted asset acquisition, is now translating into customer adoption."

The addition of RF technology to Ceva's platform expands its addressable market to include large-scale system companies and semiconductor players that require complete wireless solutions rather than digital-only IP offerings.

According to the press release, the Bluetooth connectivity market sees annual device shipments in the billions, with increasing design complexity driving demand for more integrated solutions.

"As Bluetooth evolves to support higher data throughput and more advanced use cases, the complexity of wireless design is increasing significantly," said Andrew Zignani, Senior Research Director at ABI Research. "Solutions that combine digital baseband, software stack and RF are becoming increasingly important to reduce integration effort and accelerate time-to-market."

The Bluetooth HDT platform is built on Ceva's Ceva-Waves Links family and targets industrial, consumer and edge AI applications.