Fabric.AI (NASDAQ: FABC) appointed Bill Maffucci as Head of Development for its Neural I/o chip program, a MicroLED-based optical interconnect developed jointly with Kopin Corporation (NASDAQ: KOPN). The company announced the appointment in a press release on May 6.

Maffucci will oversee development of the chip designed for high-bandwidth communication between AI systems and edge devices. The executive currently serves as Senior Vice President of Product Development & Strategy at Kopin Corporation, a position he assumed in December 2025.

Fabric.AI has signed non-disclosure agreements with two chipmakers regarding the Neural I/o technology, according to the company's CEO Josh Silverman. The agreements represent industry interest in MicroLED-based optical interconnects for AI infrastructure applications.

"Bill's combination of deep optical expertise, product leadership, and strategic vision makes him uniquely suited to lead development of the Neural I/o platform," Silverman stated in the release.

Kopin CEO Michael Murray said the company reorganized its engineering organization to focus on the project. Maffucci brings over a decade of experience at Kopin, where he previously held roles in business development, strategy, and general management.

The Neural I/o chip targets the data center optical interconnect market, which industry analysts project will reach tens of billions of dollars annually within several years. Current interconnect technologies include copper-based systems limited by signal loss and power consumption, and laser-based optical interconnects that generate heat and require precise alignment.

Fabric.AI describes itself as developing fabless semiconductor technologies for AI infrastructure after exiting its previous digital asset treasury strategy. The company partners with Kopin on MicroLED technology development.