GlobalFoundries (NASDAQ: GFS) announced the introduction of its SCALE optical module solution for co-packaged optics designed for AI data centers. The Silicon photonics Co-packaged Advanced Light Engine solution represents what the company describes as the industry's first Optical Compute Interconnect Multi-Source Agreement capable platform.

The SCALE co-packaged optics solution uses GlobalFoundries' silicon photonics technology and employs both coarse and dense wavelength-division multiplexing for bi-directional data transmission over optical fibers. The company stated it has demonstrated 8λ and 16λ bi-directional DWDM capabilities on its platform.

The solution includes 50Gbps and 100Gbps micro-ring modulators, coupled ring resonators and integrated photodiodes. Technical features include through silicon vias for high-speed signaling and power delivery, and copper pad pitches ranging from 110μm to sub-45μm for 2.5D/3D stacking applications.

The platform integrates electrical integrated circuits on advanced nodes and uses detachable fibers with flat insertion loss over the CWDM spectrum. The solution is designed to scale from 4λ in each direction to 8λ and beyond while maintaining serviceability and testability features.

"With over a decade of innovation and manufacturing expertise in silicon photonics technology at our disposal, GF stands ready to unlock the future of high-bandwidth, energy-efficient connectivity with our SCALE solution for co-packaged optics," said Mike Hogan, chief business officer at GlobalFoundries.

GlobalFoundries operates manufacturing facilities across the United States, Europe and Asia, serving automotive, aerospace and defense, data center, mobile device and internet of things markets.