Fabric.AI (NASDAQ: SBLX) announced a partnership with Kopin Corporation (NASDAQ: KOPN) to develop MicroLED-based optical interconnect technology for artificial intelligence data centers. The company also disclosed a $21.5 million private placement financing.

The collaboration focuses on developing the Neural I/O chip, which uses MicroLED technology to replace traditional electrical interconnects in AI computing systems. According to the companies, this technology enables data transmission between compute nodes while reducing energy consumption compared to copper or laser-based solutions.

Under the partnership agreement, Kopin will own 19.9% of Fabric.AI. The companies plan to jointly develop and share intellectual property created through their collaboration. Kopin brings its programmable MicroLED technology and manufacturing expertise, while Fabric.AI contributes system-level design capabilities.

"MicroLED technology represents a powerful new frontier beyond displays," said Michael Murray, CEO of Kopin Corporation. "Our collaboration with Fabric.AI extends the reach of our technology into AI infrastructure."

Fabric.AI changed its corporate name from StableX Technologies and plans to change its ticker symbol to "FABC," effective April 29, 2026. The company previously focused on digital asset treasury strategy but has shifted to AI infrastructure development.

The $21.5 million financing involves the sale of 21,500 shares of Series K convertible preferred stock at $1,000 per share to existing shareholders. The preferred shares have an initial conversion price of $2.51 per share and include accompanying warrants exercisable at the same price. The transaction is expected to close around April 29, 2026.

Josh Silverman, Fabric.AI's CEO, stated the company is developing additional semiconductor technologies for AI workloads beyond interconnects. The company reported preliminary discussions with technology companies regarding integration of its MicroLED interconnect technology.