Tower Semiconductor (NASDAQ: TSEM) and Axiro Semiconductor announced the availability of radar beamforming integrated circuits manufactured at Tower's U.S. facilities using Silicon Germanium technology. The chips are designed for defense radar and satellite communication applications.

The Ku and X-band beamforming integrated circuits are currently ramping to volume production, according to the companies' joint statement. Axiro, a U.S.-based semiconductor design company, developed the chips specifically for defense applications requiring domestic sourcing.

"Tower has an established presence as a leading vendor to the U.S. aerospace and defense industry," said Mike Scott, Vice President and General Manager of the Aerospace & Defense Business Unit at Tower Semiconductor. "This A&D experience, along with our market-leading SiGe technology capabilities, sets the foundational performance and scalability essential for modern defense systems."

Naveen Yanduru, CEO of Axiro Semiconductor, stated the company selected Tower for their Silicon Germanium technology expertise. "As a U.S.-based company, we design and deliver our domestically engineered solutions directly to American defense prime contractors," Yanduru said.

The chips are fabricated at Tower's U.S. manufacturing facilities and designed by Axiro for radar systems requiring high gain, linearity, output power, and fast-switching capabilities. The collaboration aims to strengthen domestic defense supply chains by providing U.S.-manufactured semiconductor solutions.

Tower Semiconductor operates facilities in Israel, the United States, and Japan, providing analog semiconductor manufacturing services for various markets including aerospace and defense.