Credo Technology Group Holding Ltd (NASDAQ: CRDO) will participate in multiple TSMC 2026 Technology Symposium events across seven global locations, beginning April 22 in Santa Clara, California.

The company will attend symposiums and workshops in North America, Taiwan, Europe, China, and Japan through July 3. Events include stops in Austin, Boston, Hsinchu, Amsterdam, Shanghai, and Yokohama.

Credo will demonstrate Weaver, the first solution in its OmniConnect family, which targets memory bottlenecks in AI inference applications. The product combines 112G VSR SerDes technology available in TSMC 5nm and 3nm processes with an AXI framer for connectivity between compute engines and memory systems.

According to the company's press release, OmniConnect Weaver provides 10 times the I/O beachfront density and 20 times the memory density compared to conventional LPDDR5X technology, supporting up to 5.8TB of memory density versus a maximum 256GB using LPDDR5X.

The company will also showcase its 224G PAM4 SerDes Intellectual Property developed using TSMC's 3nm process. This technology enables 224G per lane data transmission and provides 1.6Tbps bandwidth for AI, cloud computing, and hyperscale applications.

"Credo has a longstanding partnership with TSMC and we share a vision for accelerating AI through innovation and collaboration," said Jeff Twombly, Vice President of Business Development at Credo.

Credo's product portfolio includes active electrical cables, optical transceivers, memory solutions, and retimers for optical and copper Ethernet and PCIe applications.