Microchip Technology Inc. (NASDAQ: MCHP) announced the release of its SAM9X75D5M System-in-Package, an automotive-qualified hybrid microcontroller designed for human-machine interface applications in vehicles and e-mobility systems.

The device combines an Arm926EJ-S processor with 512 Mbit DDR2 SDRAM in a single package and has received AEC-Q100 Grade 2 qualification for automotive use. The system supports displays up to 10 inches with XGA resolution of 1024 × 768 pixels.

The SAM9X75D5M targets automotive applications including digital cockpit clusters, smart clusters for two- and three-wheelers, HVAC control systems, and electric vehicle chargers. The device offers display interface options including MIPI Display Serial Interface, Low Voltage Differential Signaling, and RGB data in parallel.

By integrating DDR2 memory directly into the package, the solution aims to address supply chain challenges associated with discrete memory components. The single-chip design reduces printed circuit board complexity compared to implementations using separate memory components.

"One of the advantages of a SiP is that it provides significantly more RAM buffer space than a traditional MCU implementation and on a much more compact PCB than can be done with discrete memory," said Rod Drake, corporate vice president of Microchip Technology's MPU business unit.

The device includes connectivity features such as CAN FD, USB, and Gigabit Ethernet, along with Time-Sensitive Networking protocol support. It also incorporates 2D graphics and audio capabilities.

The SAM9X75D5M is priced at $9.12 each in quantities of 5,000 units. Microchip also offers larger 1 Gbit and 2 Gbit memory variants for automotive applications, which are currently available for sampling.