Teradyne Inc. (NASDAQ: TER) announced the launch of the Photon 100, an automated test platform designed for high-volume silicon photonics and co-packaged optics manufacturing.

The platform integrates optical and electrical instrumentation with Teradyne's UltraFLEXplus platform to enable automated testing across wafer, optical engine, and co-packaged module stages. The system supports both single and double-sided wafer testing.

"The Photon 100 delivers unmatched value to our customers by providing a comprehensive, scalable, and integrated solution that simplifies the complexities of high-volume silicon photonics and co-packaged optics testing," said Geeta Athalye, vice president of Silicon Photonics Test at Teradyne.

The platform features customizable optical instrumentation with standard configurations available. It allows customers to select preferred ecosystem partners for manufacturing, including wafer-level and die-level probe options.

Teradyne designed the system to address manufacturing challenges as demand increases for high-speed optical interconnects driven by artificial intelligence applications and data center requirements. The company maintains the platform eliminates the need for customers to integrate multi-vendor solutions.

The Photon 100 will be displayed at OFC 2026 in Los Angeles from March 17-19 at booth 4732. Teradyne develops automated test equipment and robotics systems for semiconductor and electronics manufacturers.