Alpha and Omega Semiconductor Limited (NASDAQ: AOSL) announced the release of two new MOSFET products designed for AI server applications. The AONC40202 25V MOSFET and AONC68816 80V MOSFET feature DFN 3.3x3.3 double-sided cooling source-down packaging.

The devices target Intermediate Bus Converters (IBC) DC-DC applications in AI servers and data centers. Both MOSFETs incorporate double-sided thermal interface technology with optimized top-clip design for exposed drain contact, enabling heat removal from heatsinks.

The AONC40202 provides continuous current capability of up to 405A with a maximum junction temperature of 175°C. The packaging features a thermal resistance rate value of 0.9°C/W for the top interface. The source-down packaging includes a center-gate pin layout designed to facilitate PCB routing and minimize gate driver connections.

Both products utilize the company's AlphaSGT Silicon Technology. The AONC68816 80V model offers 119A continuous current capability at 25°C, with pulsed drain current of 476A.

"AOS designed these latest MOSFETs to specifically satisfy intensifying AI server power needs," said Peter H. Wilson, Sr. Director of MOSFET product line at AOS.

The MOSFETs are available immediately in production quantities with a lead time of 14-16 weeks. Unit prices in 1,000-piece quantities are $1.85 for the AONC40202 and $1.95 for the AONC68816, according to the company's press release.

Alpha and Omega Semiconductor develops discrete power devices, wide bandgap power devices, power management ICs, and modules for applications including data centers, AI servers, automotive electronics, and consumer devices.