Onto Innovation Inc. (NYSE: ONTO) announced the launch of its Dragonfly G5 inspection and metrology platform designed to detect defects as small as 150 nanometers for front-end and advanced packaging applications.

A manufacturer of high bandwidth memory selected the Dragonfly G5 system after completing competitive evaluations. The evaluation resulted in order commitments for double-digit numbers of Dragonfly G5 systems and similar orders for 3Di technology, with shipments expected to begin in the second quarter of 2026.

The Dragonfly G5 system features a new optical system supporting brightfield and darkfield techniques, delivering throughput up to five times faster than the previous generation Dragonfly technology. The system includes proprietary higher power multi-mode illumination technology for applications where current technologies struggle to separate sub-micron defects from surface variation.

The platform incorporates machine learning algorithms including flexible die-to-die detection designed to enhance detection sensitivity while reducing recipe setup time. The system will continue to support additional sensors such as Clearfind technology, sub-surface defect inspection, and 3D metrology.

"The significantly enhanced base platform enables a suite of powerful new capabilities designed specifically to address emerging process control challenges in 3D and 2.5D packaging applications," said Mike Plisinski, chief executive officer of Onto Innovation.

The company stated these capabilities are expected to extend the system into new inspection applications representing more than $500 million in serviceable available market. Onto Innovation noted that advanced packaging is expected to demonstrate greater than 30% growth in 2026.

The information is based on a company press release.