Teradyne Inc. (NASDAQ: TER) announced the launch of Omnyx, a manufacturing test platform designed for printed circuit board assemblies and sub-assemblies used in AI and data center applications.

The platform integrates structural, parametric, high-speed interconnect, and functional tests into a single system. According to the company, this approach addresses manufacturing challenges by reducing defect escapes and improving assembly quality.

Omnyx incorporates high-speed interconnect and mission-mode testing capabilities that provide coverage for at-speed and operational defects typically detected only during functional test phases. The system aims to identify defects earlier in the manufacturing process to improve end-of-line yield.

"Teradyne Omnyx represents a significant leap forward in PCBA testing, providing our customers with the tools they need to meet the demands of modern AI and data center hardware," said Mark Kahwati, general manager of the Production Board Test division at Teradyne.

The company stated that traditional in-circuit testing, which focuses on structural and parametric faults, is insufficient for next-generation AI and data center products due to their increased complexity and value. The new platform addresses signal integrity and operational defects that conventional testing methods may miss.

Teradyne will demonstrate the Omnyx platform at IPC APEX EXPO in Anaheim, California from March 17-19 at booth 2100. The company designs and manufactures automated test equipment and advanced robotics systems for semiconductor and electronics testing applications.