Micron Technology Inc. (NASDAQ: MU) announced it has begun shipping qualification samples of its automotive universal flash storage (UFS) 4.1 solution to customers worldwide. The storage solution delivers 4.2 gigabytes per second bandwidth, which the company states is double that of its predecessor.

The automotive UFS 4.1 is built with Micron's 9th-generation 3D NAND flash memory technology. According to the company, the solution is designed to accelerate data access for AI models in vehicles and enable features such as voice assistants, personalized infotainment and advanced safety alerts.

The storage solution offers up to 100,000 program/erase cycles for single-level cell mode and 3,000 program/erase cycles for triple-level cell mode. Micron states the solution provides thermal protection and performance from -40°C up to 115°C case temperature, extending beyond JEDEC's standard 105°C specification.

According to Micron's internal testing, the UFS 4.1 offers 30% faster device boot and 18% faster system boot compared to the company's UFS 3.1 predecessor devices. The solution achieves Automotive Safety Integrity Level B compliance under ISO 26262 standards for functional safety.

"Micron's automotive UFS 4.1 is engineered to deliver exceptional safety, reliability and performance, enabling the automotive industry to advance intelligent mobility and unlock AI at the edge," said Kris Baxter, corporate vice president and general manager of Micron's Automotive and Embedded Business Unit.

The solution includes real-time telemetry capabilities with health monitoring and device-level exception notifications. Micron states its G9 NAND technology has been qualified for automotive standards including AEC-Q104.

The information is based on a company press release statement made at the Automotive Computing Conference in Munich.