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Cadence Significantly Advances ECAD/MCAD Convergence for Electronic Systems with New Celsius Studio AI Thermal Platform

January 31, 2024 10:45 AM

Highlights:

SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced Cadence® Celsius™ Studio, the industry’s first complete AI thermal design and analysis solution for electronic systems. Celsius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies. While current product offerings consist mostly of disparate point tools, Celsius Studio introduces an entirely new approach with a unified platform that lets electrical and mechanical/thermal engineers concurrently design, analyze and optimize product performance without the need for geometry simplification, manipulation and/or translation.

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The industry’s first complete AI thermal design and analysis solution for electronic systems, Cadence® Celsius™ Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies. (Graphic: Business Wire)

The industry’s first complete AI thermal design and analysis solution for electronic systems, Cadence® Celsius™ Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies. (Graphic: Business Wire)

Celsius Studio brings a new system-level thermal integrity solution into the marketplace, converging electro-thermal co-simulation, electronics cooling and thermal stress into one cohesive offering. Made possible by Cadence’s acquisition of Future Facilities in 2022, best-in-class electronics cooling technology is now accessible to electrical and mechanical engineers. Additionally, the ability to employ Celsius Studio seamlessly for in-design multiphysics analysis empowers designers to identify thermal integrity issues early in the design process and efficiently leverage generative AI optimization and novel modeling algorithms to determine ideal thermal designs.

The result is a streamlined workflow that improves collaboration, reduces design iterations and allows predictable design schedules, which in turn reduces turnaround times and accelerates time to market. Celsius Studio delivers the following benefits:

“Celsius Studio marks a milestone in Cadence’s expanding presence in the system analysis market by offering the first AI platform for not only chip, package and PCB thermal analysis, but also electronics cooling and thermal stress that are critical for today’s advanced packaging designs, inclusive of chiplets and 3D-ICs,” said Ben Gu, corporate vice president of R&D for multiphysics system analysis at Cadence. “Seamless integration with Cadence’s powerful implementation platforms empowers our customers to perform multiphysics in-design analysis for chips, packages and boards all the way through to complete systems.”

Customer Endorsements

“Celsius Studio enables Samsung Semiconductor engineers the ability to gain access to analysis and design insights during the early stages of the design cycle, simplifying the generation of precise and rapid thermal simulations for 3D-IC and 2.5D packages. Our collaboration with Cadence has significantly increased our product development by 30%, optimizing the package design process and reducing turnaround time.”
WooPoung Kim, Head of Advanced Packaging, Samsung Device Solutions Research America

“Celsius Studio’s seamless integration with Cadence’s AWR Microwave Office IC design platform through BAE Systems’ custom GaN PDK is enabling fast and accurate thermal analysis throughout the MMIC design cycle, leading to increased first-pass design success and significantly improved RF and thermal power amplifier performance.”
Michael Litchfield, Technical Director, MMIC Design at BAE Systems

“Celsius Studio enables our design team to work with detailed information early in our design cycle so that we can target and resolve thermal problems before the design is fully committed. With the reduced turnaround time, the Chipletz engineering team has been empowered to efficiently run detailed thermal simulations for 3D-IC and 2.5D packages early and often as we develop these complex designs.”
Jeff Cain, VP of Engineering, Chipletz

Availability

For more information on Celsius Studio, please visit www.cadence.com/go/cstudiopr. Customers interested in gaining early access to Celsius Studio should contact their Cadence account representative.

About Cadence

Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware, and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For nine years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

© 2024 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

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Source: Cadence Design Systems, Inc.

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