http://www.streetinsider.com Latest StreetInsider.com News Articles en-us Copyright 2026, StreetInsider.com rss@streetinsider.com (SI RSS) rss@streetinsider.com (SI RSS) Mon, 27 Jul 2026 09:01:23 -0400 http://blogs.law.harvard.edu/tech/rss http://www.streetinsider.com/images/rss_logo.gif http://www.streetinsider.com 143 28 0 1 2 3 21 22 23 Saturday Sunday http://www.streetinsider.com/Corporate+News/Synopsys+launches+autonomous+chip+design+workflows+with+Microsoft%2C+AMD/26817013.html <p>Synopsys, Inc. (NASDAQ: SNPS) has introduced two autonomous electronic design automation (EDA) workflows developed in collaboration with Microsoft and evaluated by AMD, available on Microsoft Discovery.</p><p>The two workflows, announced at the 2026 DAC Chips to Systems Conference, are described as the first EDA applications available for evaluation on Microsoft Discovery. The first is a fully autonomous debug closure workflow that combines domain-specific and task-level agents to identify design failures and automate debug tasks. Early evaluations show a 25% to 40% reduction in debug cycle time. The second is an autonomous implementation and closure workflow that uses Synopsys' Fusion Compiler on http://www.streetinsider.com/Corporate+News/Synopsys+launches+autonomous+chip+design+workflows+with+Microsoft%2C+AMD/26817013.html Mon, 27 Jul 2026 09:01:23 -0400 AMD MSFT SNPS http://www.streetinsider.com/Corporate+News/Synopsys+launches+autonomous+chip+design+workflows+with+Microsoft%2C+AMD/26817013.html <p>Synopsys, Inc. (NASDAQ: SNPS) has introduced two autonomous electronic design automation (EDA) workflows developed in collaboration with Microsoft and evaluated by AMD, available on Microsoft Discovery.</p><p>The two workflows, announced at the 2026 DAC Chips to Systems Conference, are described as the first EDA applications available for evaluation on Microsoft Discovery. The first is a fully autonomous debug closure workflow that combines domain-specific and task-level agents to identify design failures and automate debug tasks. Early evaluations show a 25% to 40% reduction in debug cycle time. The second is an autonomous implementation and closure workflow that uses Synopsys' Fusion Compiler on http://www.streetinsider.com/Corporate+News/Synopsys+launches+autonomous+chip+design+workflows+with+Microsoft%2C+AMD/26817013.html Mon, 27 Jul 2026 09:01:23 -0400 AMD MSFT SNPS http://www.streetinsider.com/Corporate+News/Synopsys+launches+autonomous+chip+design+workflows+with+Microsoft%2C+AMD/26817013.html <p>Synopsys, Inc. (NASDAQ: SNPS) has introduced two autonomous electronic design automation (EDA) workflows developed in collaboration with Microsoft and evaluated by AMD, available on Microsoft Discovery.</p><p>The two workflows, announced at the 2026 DAC Chips to Systems Conference, are described as the first EDA applications available for evaluation on Microsoft Discovery. The first is a fully autonomous debug closure workflow that combines domain-specific and task-level agents to identify design failures and automate debug tasks. Early evaluations show a 25% to 40% reduction in debug cycle time. The second is an autonomous implementation and closure workflow that uses Synopsys' Fusion Compiler on http://www.streetinsider.com/Corporate+News/Synopsys+launches+autonomous+chip+design+workflows+with+Microsoft%2C+AMD/26817013.html Mon, 27 Jul 2026 09:01:23 -0400 AMD MSFT SNPS http://www.streetinsider.com/Hot+Corp.+News/Synopsys+launches+autonomous+chip+design+workflows+with+Microsoft%2C+AMD/26817013.html <p>Synopsys, Inc. (NASDAQ: SNPS) has introduced two autonomous electronic design automation (EDA) workflows developed in collaboration with Microsoft and evaluated by AMD, available on Microsoft Discovery.</p><p>The two workflows, announced at the 2026 DAC Chips to Systems Conference, are described as the first EDA applications available for evaluation on Microsoft Discovery. The first is a fully autonomous debug closure workflow that combines domain-specific and task-level agents to identify design failures and automate debug tasks. Early evaluations show a 25% to 40% reduction in debug cycle time. The second is an autonomous implementation and closure workflow that uses Synopsys' Fusion Compiler on http://www.streetinsider.com/Hot+Corp.+News/Synopsys+launches+autonomous+chip+design+workflows+with+Microsoft%2C+AMD/26817013.html Mon, 27 Jul 2026 09:01:23 -0400 AMD MSFT SNPS http://www.streetinsider.com/Hot+Corp.+News/Synopsys+launches+autonomous+chip+design+workflows+with+Microsoft%2C+AMD/26817013.html <p>Synopsys, Inc. (NASDAQ: SNPS) has introduced two autonomous electronic design automation (EDA) workflows developed in collaboration with Microsoft and evaluated by AMD, available on Microsoft Discovery.</p><p>The two workflows, announced at the 2026 DAC Chips to Systems Conference, are described as the first EDA applications available for evaluation on Microsoft Discovery. The first is a fully autonomous debug closure workflow that combines domain-specific and task-level agents to identify design failures and automate debug tasks. Early evaluations show a 25% to 40% reduction in debug cycle time. The second is an autonomous implementation and closure workflow that uses Synopsys' Fusion Compiler on http://www.streetinsider.com/Hot+Corp.+News/Synopsys+launches+autonomous+chip+design+workflows+with+Microsoft%2C+AMD/26817013.html Mon, 27 Jul 2026 09:01:23 -0400 AMD MSFT SNPS http://www.streetinsider.com/Hot+Corp.+News/Synopsys+launches+autonomous+chip+design+workflows+with+Microsoft%2C+AMD/26817013.html <p>Synopsys, Inc. (NASDAQ: SNPS) has introduced two autonomous electronic design automation (EDA) workflows developed in collaboration with Microsoft and evaluated by AMD, available on Microsoft Discovery.</p><p>The two workflows, announced at the 2026 DAC Chips to Systems Conference, are described as the first EDA applications available for evaluation on Microsoft Discovery. The first is a fully autonomous debug closure workflow that combines domain-specific and task-level agents to identify design failures and automate debug tasks. Early evaluations show a 25% to 40% reduction in debug cycle time. The second is an autonomous implementation and closure workflow that uses Synopsys' Fusion Compiler on http://www.streetinsider.com/Hot+Corp.+News/Synopsys+launches+autonomous+chip+design+workflows+with+Microsoft%2C+AMD/26817013.html Mon, 27 Jul 2026 09:01:23 -0400 AMD MSFT SNPS http://www.streetinsider.com/Corporate+News/Synopsys+expands+Intel+Foundry+collaboration+for+Intel+14A+process/26816992.html <p>Synopsys, Inc. (Nasdaq: SNPS) announced an expanded collaboration with Intel Foundry at the 2026 DAC Chips to Systems Conference, including the certification of AI-powered electronic design automation flows on Intel's 14A process technology.</p><p>The collaboration extends co-optimization across silicon, packaging, IP, and system domains. Synopsys said its 3DIC Compiler platform now supports Intel's Embedded Multi-die Interconnect Bridge (EMIB) and EMIB-T advanced packaging technologies, enabling multi-die chip designs with integrated power, thermal, and signal integrity analysis.</p><p>Synopsys also announced an expanded IP portfolio for Intel 14A, including interface IP such as 224G SerDes, PCIe 7.0, USB 4, and eUSB, along with foundation IP http://www.streetinsider.com/Corporate+News/Synopsys+expands+Intel+Foundry+collaboration+for+Intel+14A+process/26816992.html Mon, 27 Jul 2026 09:00:59 -0400 INTC SNPS http://www.streetinsider.com/Corporate+News/Synopsys+expands+Intel+Foundry+collaboration+for+Intel+14A+process/26816992.html <p>Synopsys, Inc. (Nasdaq: SNPS) announced an expanded collaboration with Intel Foundry at the 2026 DAC Chips to Systems Conference, including the certification of AI-powered electronic design automation flows on Intel's 14A process technology.</p><p>The collaboration extends co-optimization across silicon, packaging, IP, and system domains. Synopsys said its 3DIC Compiler platform now supports Intel's Embedded Multi-die Interconnect Bridge (EMIB) and EMIB-T advanced packaging technologies, enabling multi-die chip designs with integrated power, thermal, and signal integrity analysis.</p><p>Synopsys also announced an expanded IP portfolio for Intel 14A, including interface IP such as 224G SerDes, PCIe 7.0, USB 4, and eUSB, along with foundation IP http://www.streetinsider.com/Corporate+News/Synopsys+expands+Intel+Foundry+collaboration+for+Intel+14A+process/26816992.html Mon, 27 Jul 2026 09:00:59 -0400 INTC SNPS http://www.streetinsider.com/Press+Releases/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html <div class="xn-content"> <p class="prntac"><i>Certified AI-powered EDA flows, integrated multiphysics analysis, and broad IP portfolio accelerate Angstrom-scale AI and multi-die </i><i>designs</i></p><p><b>Key Highlights</b></p><ul type="disc"><li><b>Certified AI-powered EDA flows and multiphysics analysis for Intel 14A designs:</b> Provide early insight into power integrity, thermal, and electromagnetic effects, improving predictability and accelerating convergence</li><li><b>From DTCO to system-aware co-optimization</b>: Extends co-optimization across silicon, package, IP and system domains to enable full system realization with optimal PPA</li><li><b>Multi-die and advanced packaging leadership</b>: <span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> 3DIC Compiler platform extends exploration-to-signoff support to designs integrated with Intel EMIB and Intel EMIB-T, enabling multi-die designs</li><li><b>Broad IP portfolio for faster time-to-tapeout</b>: Interface and Foundation IP http://www.streetinsider.com/Press+Releases/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html Mon, 27 Jul 2026 09:00:00 -0400 A.50204642 O.00082314 O.00163521 SNPS http://www.streetinsider.com/Press+Releases/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html <div class="xn-content"> <p class="prntac"><i>Certified AI-powered EDA flows, integrated multiphysics analysis, and broad IP portfolio accelerate Angstrom-scale AI and multi-die </i><i>designs</i></p><p><b>Key Highlights</b></p><ul type="disc"><li><b>Certified AI-powered EDA flows and multiphysics analysis for Intel 14A designs:</b> Provide early insight into power integrity, thermal, and electromagnetic effects, improving predictability and accelerating convergence</li><li><b>From DTCO to system-aware co-optimization</b>: Extends co-optimization across silicon, package, IP and system domains to enable full system realization with optimal PPA</li><li><b>Multi-die and advanced packaging leadership</b>: <span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> 3DIC Compiler platform extends exploration-to-signoff support to designs integrated with Intel EMIB and Intel EMIB-T, enabling multi-die designs</li><li><b>Broad IP portfolio for faster time-to-tapeout</b>: Interface and Foundation IP http://www.streetinsider.com/Press+Releases/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html Mon, 27 Jul 2026 09:00:00 -0400 A.50204642 O.00082314 O.00163521 SNPS http://www.streetinsider.com/Press+Releases/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html <div class="xn-content"> <p class="prntac"><i>Certified AI-powered EDA flows, integrated multiphysics analysis, and broad IP portfolio accelerate Angstrom-scale AI and multi-die </i><i>designs</i></p><p><b>Key Highlights</b></p><ul type="disc"><li><b>Certified AI-powered EDA flows and multiphysics analysis for Intel 14A designs:</b> Provide early insight into power integrity, thermal, and electromagnetic effects, improving predictability and accelerating convergence</li><li><b>From DTCO to system-aware co-optimization</b>: Extends co-optimization across silicon, package, IP and system domains to enable full system realization with optimal PPA</li><li><b>Multi-die and advanced packaging leadership</b>: <span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> 3DIC Compiler platform extends exploration-to-signoff support to designs integrated with Intel EMIB and Intel EMIB-T, enabling multi-die designs</li><li><b>Broad IP portfolio for faster time-to-tapeout</b>: Interface and Foundation IP http://www.streetinsider.com/Press+Releases/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html Mon, 27 Jul 2026 09:00:00 -0400 A.50204642 O.00082314 O.00163521 SNPS http://www.streetinsider.com/Press+Releases/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html <div class="xn-content"> <p class="prntac"><i>Certified AI-powered EDA flows, integrated multiphysics analysis, and broad IP portfolio accelerate Angstrom-scale AI and multi-die </i><i>designs</i></p><p><b>Key Highlights</b></p><ul type="disc"><li><b>Certified AI-powered EDA flows and multiphysics analysis for Intel 14A designs:</b> Provide early insight into power integrity, thermal, and electromagnetic effects, improving predictability and accelerating convergence</li><li><b>From DTCO to system-aware co-optimization</b>: Extends co-optimization across silicon, package, IP and system domains to enable full system realization with optimal PPA</li><li><b>Multi-die and advanced packaging leadership</b>: <span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> 3DIC Compiler platform extends exploration-to-signoff support to designs integrated with Intel EMIB and Intel EMIB-T, enabling multi-die designs</li><li><b>Broad IP portfolio for faster time-to-tapeout</b>: Interface and Foundation IP http://www.streetinsider.com/Press+Releases/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html Mon, 27 Jul 2026 09:00:00 -0400 A.50204642 O.00082314 O.00163521 SNPS http://www.streetinsider.com/PRNewswire/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html <div class="xn-content"> <p class="prntac"><i>Certified AI-powered EDA flows, integrated multiphysics analysis, and broad IP portfolio accelerate Angstrom-scale AI and multi-die </i><i>designs</i></p><p><b>Key Highlights</b></p><ul type="disc"><li><b>Certified AI-powered EDA flows and multiphysics analysis for Intel 14A designs:</b> Provide early insight into power integrity, thermal, and electromagnetic effects, improving predictability and accelerating convergence</li><li><b>From DTCO to system-aware co-optimization</b>: Extends co-optimization across silicon, package, IP and system domains to enable full system realization with optimal PPA</li><li><b>Multi-die and advanced packaging leadership</b>: <span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> 3DIC Compiler platform extends exploration-to-signoff support to designs integrated with Intel EMIB and Intel EMIB-T, enabling multi-die designs</li><li><b>Broad IP portfolio for faster time-to-tapeout</b>: Interface and Foundation IP http://www.streetinsider.com/PRNewswire/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html Mon, 27 Jul 2026 09:00:00 -0400 A.50204642 O.00082314 O.00163521 SNPS http://www.streetinsider.com/PRNewswire/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html <div class="xn-content"> <p class="prntac"><i>Certified AI-powered EDA flows, integrated multiphysics analysis, and broad IP portfolio accelerate Angstrom-scale AI and multi-die </i><i>designs</i></p><p><b>Key Highlights</b></p><ul type="disc"><li><b>Certified AI-powered EDA flows and multiphysics analysis for Intel 14A designs:</b> Provide early insight into power integrity, thermal, and electromagnetic effects, improving predictability and accelerating convergence</li><li><b>From DTCO to system-aware co-optimization</b>: Extends co-optimization across silicon, package, IP and system domains to enable full system realization with optimal PPA</li><li><b>Multi-die and advanced packaging leadership</b>: <span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> 3DIC Compiler platform extends exploration-to-signoff support to designs integrated with Intel EMIB and Intel EMIB-T, enabling multi-die designs</li><li><b>Broad IP portfolio for faster time-to-tapeout</b>: Interface and Foundation IP http://www.streetinsider.com/PRNewswire/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html Mon, 27 Jul 2026 09:00:00 -0400 A.50204642 O.00082314 O.00163521 SNPS http://www.streetinsider.com/PRNewswire/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html <div class="xn-content"> <p class="prntac"><i>Certified AI-powered EDA flows, integrated multiphysics analysis, and broad IP portfolio accelerate Angstrom-scale AI and multi-die </i><i>designs</i></p><p><b>Key Highlights</b></p><ul type="disc"><li><b>Certified AI-powered EDA flows and multiphysics analysis for Intel 14A designs:</b> Provide early insight into power integrity, thermal, and electromagnetic effects, improving predictability and accelerating convergence</li><li><b>From DTCO to system-aware co-optimization</b>: Extends co-optimization across silicon, package, IP and system domains to enable full system realization with optimal PPA</li><li><b>Multi-die and advanced packaging leadership</b>: <span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> 3DIC Compiler platform extends exploration-to-signoff support to designs integrated with Intel EMIB and Intel EMIB-T, enabling multi-die designs</li><li><b>Broad IP portfolio for faster time-to-tapeout</b>: Interface and Foundation IP http://www.streetinsider.com/PRNewswire/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html Mon, 27 Jul 2026 09:00:00 -0400 A.50204642 O.00082314 O.00163521 SNPS http://www.streetinsider.com/PRNewswire/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html <div class="xn-content"> <p class="prntac"><i>Certified AI-powered EDA flows, integrated multiphysics analysis, and broad IP portfolio accelerate Angstrom-scale AI and multi-die </i><i>designs</i></p><p><b>Key Highlights</b></p><ul type="disc"><li><b>Certified AI-powered EDA flows and multiphysics analysis for Intel 14A designs:</b> Provide early insight into power integrity, thermal, and electromagnetic effects, improving predictability and accelerating convergence</li><li><b>From DTCO to system-aware co-optimization</b>: Extends co-optimization across silicon, package, IP and system domains to enable full system realization with optimal PPA</li><li><b>Multi-die and advanced packaging leadership</b>: <span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> 3DIC Compiler platform extends exploration-to-signoff support to designs integrated with Intel EMIB and Intel EMIB-T, enabling multi-die designs</li><li><b>Broad IP portfolio for faster time-to-tapeout</b>: Interface and Foundation IP http://www.streetinsider.com/PRNewswire/Synopsys+and+Intel+Foundry+Fast-Track+Customer+Readiness+from+Silicon+to+Systems+on+Intel+14A/26816946.html Mon, 27 Jul 2026 09:00:00 -0400 A.50204642 O.00082314 O.00163521 SNPS http://www.streetinsider.com/Press+Releases/Synopsys+Advances+Agentic+AI+Chip+Design+with+AMD+and+Microsoft/26816949.html <div class="xn-content"> <p class="prntal"><i>Introduces Industry's First Autonomous EDA Workflows on Microsoft Discovery to Accelerate Engineering from Specification to Silicon</i></p><p><b>Key Highlights </b></p><ul type="disc"><li><span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> is advancing an open, interoperable agentic AI stack for autonomous workflows across the chip design lifecycle.</li><li>Introducing two new agentic EDA workflows, developed in collaboration with Microsoft and used by AMD, available for evaluation on Microsoft Discovery to accelerate chip design.</li><li>Fully-autonomous debug closure workflow initial results demonstrate up to 40% reduction in cycle time</li></ul><p><span class="legendSpanClass"><location value="LU/us.ca.sunyvl" idsrc="xmltag.org" >SUNNYVALE, Calif.</location></span>, <span class="legendSpanClass"><chron>July 27, 2026</chron></span> /PRNewswire/ -- <a target="_blank" href="https://edge.prnewswire.com/c/link/?t=0&amp;l=en&amp;o=4739039-1&amp;h=1649944988&amp;u=https%3A%2F%2Fwww.synopsys.com%2F&amp;a=Synopsys%2C+Inc" target="_blank" rel="nofollow"><span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys, Inc</span></a>. (NASDAQ: SNPS) announced http://www.streetinsider.com/Press+Releases/Synopsys+Advances+Agentic+AI+Chip+Design+with+AMD+and+Microsoft/26816949.html Mon, 27 Jul 2026 09:00:00 -0400 O.00082314 SNPS http://www.streetinsider.com/Press+Releases/Synopsys+Advances+Agentic+AI+Chip+Design+with+AMD+and+Microsoft/26816949.html <div class="xn-content"> <p class="prntal"><i>Introduces Industry's First Autonomous EDA Workflows on Microsoft Discovery to Accelerate Engineering from Specification to Silicon</i></p><p><b>Key Highlights </b></p><ul type="disc"><li><span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> is advancing an open, interoperable agentic AI stack for autonomous workflows across the chip design lifecycle.</li><li>Introducing two new agentic EDA workflows, developed in collaboration with Microsoft and used by AMD, available for evaluation on Microsoft Discovery to accelerate chip design.</li><li>Fully-autonomous debug closure workflow initial results demonstrate up to 40% reduction in cycle time</li></ul><p><span class="legendSpanClass"><location value="LU/us.ca.sunyvl" idsrc="xmltag.org" >SUNNYVALE, Calif.</location></span>, <span class="legendSpanClass"><chron>July 27, 2026</chron></span> /PRNewswire/ -- <a target="_blank" href="https://edge.prnewswire.com/c/link/?t=0&amp;l=en&amp;o=4739039-1&amp;h=1649944988&amp;u=https%3A%2F%2Fwww.synopsys.com%2F&amp;a=Synopsys%2C+Inc" target="_blank" rel="nofollow"><span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys, Inc</span></a>. (NASDAQ: SNPS) announced http://www.streetinsider.com/Press+Releases/Synopsys+Advances+Agentic+AI+Chip+Design+with+AMD+and+Microsoft/26816949.html Mon, 27 Jul 2026 09:00:00 -0400 O.00082314 SNPS http://www.streetinsider.com/PRNewswire/Synopsys+Advances+Agentic+AI+Chip+Design+with+AMD+and+Microsoft/26816949.html <div class="xn-content"> <p class="prntal"><i>Introduces Industry's First Autonomous EDA Workflows on Microsoft Discovery to Accelerate Engineering from Specification to Silicon</i></p><p><b>Key Highlights </b></p><ul type="disc"><li><span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> is advancing an open, interoperable agentic AI stack for autonomous workflows across the chip design lifecycle.</li><li>Introducing two new agentic EDA workflows, developed in collaboration with Microsoft and used by AMD, available for evaluation on Microsoft Discovery to accelerate chip design.</li><li>Fully-autonomous debug closure workflow initial results demonstrate up to 40% reduction in cycle time</li></ul><p><span class="legendSpanClass"><location value="LU/us.ca.sunyvl" idsrc="xmltag.org" >SUNNYVALE, Calif.</location></span>, <span class="legendSpanClass"><chron>July 27, 2026</chron></span> /PRNewswire/ -- <a target="_blank" href="https://edge.prnewswire.com/c/link/?t=0&amp;l=en&amp;o=4739039-1&amp;h=1649944988&amp;u=https%3A%2F%2Fwww.synopsys.com%2F&amp;a=Synopsys%2C+Inc" target="_blank" rel="nofollow"><span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys, Inc</span></a>. (NASDAQ: SNPS) announced http://www.streetinsider.com/PRNewswire/Synopsys+Advances+Agentic+AI+Chip+Design+with+AMD+and+Microsoft/26816949.html Mon, 27 Jul 2026 09:00:00 -0400 O.00082314 SNPS http://www.streetinsider.com/PRNewswire/Synopsys+Advances+Agentic+AI+Chip+Design+with+AMD+and+Microsoft/26816949.html <div class="xn-content"> <p class="prntal"><i>Introduces Industry's First Autonomous EDA Workflows on Microsoft Discovery to Accelerate Engineering from Specification to Silicon</i></p><p><b>Key Highlights </b></p><ul type="disc"><li><span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> is advancing an open, interoperable agentic AI stack for autonomous workflows across the chip design lifecycle.</li><li>Introducing two new agentic EDA workflows, developed in collaboration with Microsoft and used by AMD, available for evaluation on Microsoft Discovery to accelerate chip design.</li><li>Fully-autonomous debug closure workflow initial results demonstrate up to 40% reduction in cycle time</li></ul><p><span class="legendSpanClass"><location value="LU/us.ca.sunyvl" idsrc="xmltag.org" >SUNNYVALE, Calif.</location></span>, <span class="legendSpanClass"><chron>July 27, 2026</chron></span> /PRNewswire/ -- <a target="_blank" href="https://edge.prnewswire.com/c/link/?t=0&amp;l=en&amp;o=4739039-1&amp;h=1649944988&amp;u=https%3A%2F%2Fwww.synopsys.com%2F&amp;a=Synopsys%2C+Inc" target="_blank" rel="nofollow"><span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys, Inc</span></a>. (NASDAQ: SNPS) announced http://www.streetinsider.com/PRNewswire/Synopsys+Advances+Agentic+AI+Chip+Design+with+AMD+and+Microsoft/26816949.html Mon, 27 Jul 2026 09:00:00 -0400 O.00082314 SNPS http://www.streetinsider.com/Corporate+News/Synopsys+unveils+agentic+chip+design+tools+built+with+Nvidia/26815449.html <p>Synopsys, Inc. (NASDAQ: SNPS) announced a set of autonomous, AI-driven engineering workflows at the 2026 DAC Chips to Systems Conference, developed in collaboration with Nvidia.</p><p>The announcements center on a fully autonomous design verification agent built on Synopsys' AgentEngineer technology and Nvidia's agentic AI infrastructure, including the Nvidia Agent Toolkit, Nvidia Nemotron 3 Ultra model, and OpenShell runtime. According to the company, the workflow compresses chip verification from weeks to hours, delivering up to 50 times faster time-to-validated RTL and a 20% improvement in coverage compared to traditional verification workflows not powered by AgentEngineer technology.</p><p>Synopsys also demonstrated its first autonomous computer-aided http://www.streetinsider.com/Corporate+News/Synopsys+unveils+agentic+chip+design+tools+built+with+Nvidia/26815449.html Mon, 27 Jul 2026 06:03:58 -0400 SNPS http://www.streetinsider.com/Press+Releases/Synopsys+Showcases+Comprehensive+Autonomous+Engineering+Workflows+from+Silicon+to+Systems%2C+Developed+with+NVIDIA+Technology/26814896.html <div class="xn-content"> <p class="prntac"><i>New long-running, fully agentic workflows spanning EDA to CAE multiply engineering productivity </i></p><p><b>Key Highlights</b></p><ul type="disc"><li><span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> unveils a fully autonomous long-running design verification agent that orchestrates the entire chip verification cycle delivering up to 50X faster time-to-validated RTL while achieving 20% additional coverage improvement</li><li>Demonstrating Synopsys' first fully autonomous computer-aided engineering (CAE) workflow for thermal management and electronic device cooling capable of autonomously executing set-up, pre-processing, and post-processing in a fraction of the time required for manual approaches </li><li>Expanded portfolio of more than 20 GPU-accelerated Synopsys EDA and multiphysics products, including 18X speedup of <a target="_blank" href="https://edge.prnewswire.com/c/link/?t=0&amp;l=en&amp;o=4738942-1&amp;h=2407958161&amp;u=https%3A%2F%2Fwww.synopsys.com%2Fimplementation-and-signoff%2Fams-simulation%2Fprimesim-spice.html&amp;a=PrimeSim%E2%84%A2+SPICE" target="_blank" http://www.streetinsider.com/Press+Releases/Synopsys+Showcases+Comprehensive+Autonomous+Engineering+Workflows+from+Silicon+to+Systems%2C+Developed+with+NVIDIA+Technology/26814896.html Sun, 26 Jul 2026 20:45:00 -0400 A.30057053 O.00082314 O.00175295 SNPS http://www.streetinsider.com/Press+Releases/Synopsys+Showcases+Comprehensive+Autonomous+Engineering+Workflows+from+Silicon+to+Systems%2C+Developed+with+NVIDIA+Technology/26814896.html <div class="xn-content"> <p class="prntac"><i>New long-running, fully agentic workflows spanning EDA to CAE multiply engineering productivity </i></p><p><b>Key Highlights</b></p><ul type="disc"><li><span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> unveils a fully autonomous long-running design verification agent that orchestrates the entire chip verification cycle delivering up to 50X faster time-to-validated RTL while achieving 20% additional coverage improvement</li><li>Demonstrating Synopsys' first fully autonomous computer-aided engineering (CAE) workflow for thermal management and electronic device cooling capable of autonomously executing set-up, pre-processing, and post-processing in a fraction of the time required for manual approaches </li><li>Expanded portfolio of more than 20 GPU-accelerated Synopsys EDA and multiphysics products, including 18X speedup of <a target="_blank" href="https://edge.prnewswire.com/c/link/?t=0&amp;l=en&amp;o=4738942-1&amp;h=2407958161&amp;u=https%3A%2F%2Fwww.synopsys.com%2Fimplementation-and-signoff%2Fams-simulation%2Fprimesim-spice.html&amp;a=PrimeSim%E2%84%A2+SPICE" target="_blank" http://www.streetinsider.com/Press+Releases/Synopsys+Showcases+Comprehensive+Autonomous+Engineering+Workflows+from+Silicon+to+Systems%2C+Developed+with+NVIDIA+Technology/26814896.html Sun, 26 Jul 2026 20:45:00 -0400 A.30057053 O.00082314 O.00175295 SNPS http://www.streetinsider.com/Press+Releases/Synopsys+Showcases+Comprehensive+Autonomous+Engineering+Workflows+from+Silicon+to+Systems%2C+Developed+with+NVIDIA+Technology/26814896.html <div class="xn-content"> <p class="prntac"><i>New long-running, fully agentic workflows spanning EDA to CAE multiply engineering productivity </i></p><p><b>Key Highlights</b></p><ul type="disc"><li><span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> unveils a fully autonomous long-running design verification agent that orchestrates the entire chip verification cycle delivering up to 50X faster time-to-validated RTL while achieving 20% additional coverage improvement</li><li>Demonstrating Synopsys' first fully autonomous computer-aided engineering (CAE) workflow for thermal management and electronic device cooling capable of autonomously executing set-up, pre-processing, and post-processing in a fraction of the time required for manual approaches </li><li>Expanded portfolio of more than 20 GPU-accelerated Synopsys EDA and multiphysics products, including 18X speedup of <a target="_blank" href="https://edge.prnewswire.com/c/link/?t=0&amp;l=en&amp;o=4738942-1&amp;h=2407958161&amp;u=https%3A%2F%2Fwww.synopsys.com%2Fimplementation-and-signoff%2Fams-simulation%2Fprimesim-spice.html&amp;a=PrimeSim%E2%84%A2+SPICE" target="_blank" http://www.streetinsider.com/Press+Releases/Synopsys+Showcases+Comprehensive+Autonomous+Engineering+Workflows+from+Silicon+to+Systems%2C+Developed+with+NVIDIA+Technology/26814896.html Sun, 26 Jul 2026 20:45:00 -0400 A.30057053 O.00082314 O.00175295 SNPS http://www.streetinsider.com/Press+Releases/Synopsys+Showcases+Comprehensive+Autonomous+Engineering+Workflows+from+Silicon+to+Systems%2C+Developed+with+NVIDIA+Technology/26814896.html <div class="xn-content"> <p class="prntac"><i>New long-running, fully agentic workflows spanning EDA to CAE multiply engineering productivity </i></p><p><b>Key Highlights</b></p><ul type="disc"><li><span value="NASDAQ-NMS:SNPS" idsrc="xmltag.org" >Synopsys</span> unveils a fully autonomous long-running design verification agent that orchestrates the entire chip verification cycle delivering up to 50X faster time-to-validated RTL while achieving 20% additional coverage improvement</li><li>Demonstrating Synopsys' first fully autonomous computer-aided engineering (CAE) workflow for thermal management and electronic device cooling capable of autonomously executing set-up, pre-processing, and post-processing in a fraction of the time required for manual approaches </li><li>Expanded portfolio of more than 20 GPU-accelerated Synopsys EDA and multiphysics products, including 18X speedup of <a target="_blank" href="https://edge.prnewswire.com/c/link/?t=0&amp;l=en&amp;o=4738942-1&amp;h=2407958161&amp;u=https%3A%2F%2Fwww.synopsys.com%2Fimplementation-and-signoff%2Fams-simulation%2Fprimesim-spice.html&amp;a=PrimeSim%E2%84%A2+SPICE" target="_blank" http://www.streetinsider.com/Press+Releases/Synopsys+Showcases+Comprehensive+Autonomous+Engineering+Workflows+from+Silicon+to+Systems%2C+Developed+with+NVIDIA+Technology/26814896.html Sun, 26 Jul 2026 20:45:00 -0400 A.30057053 O.00082314 O.00175295 SNPS