InterDigital to Participate in IEEE Webinar on Future of Spectrum Harvesting Technology

WILMINGTON, Del., June 17, 2014 (GLOBE NEWSWIRE) -- InterDigital, Inc. (Nasdaq: IDCC), a wireless research and development company, will participate in "The Future of Spectrum Harvesting Technology," a webinar hosted by IEEE, on June 18, 2014.

During the webinar, Angelo Cuffaro, Senior Director, InterDigital Labs, will join experts from Aviacomm, Texas Instruments and Shared Spectrum to examine the potential impact of spectrum harvesting on the impending bandwidth crunch, including key use-cases for this technology and the requirements to make it a viable solution. The panelists will also discuss the future of the space and the role of coexistence in the shared spectrum bands.

"Today we're at a point where a lot of activity is taking place on both the regulatory side and with interest groups to help move this technology forward," commented Dr. Byung K. Yi, Executive Vice President, InterDigital Labs, and Chief Technology Officer at InterDigital. "We all know that bandwidth needs continue to increase, and we need to continue to focus on the technologies that will help take advantage of TV whitespace and other underutilized spectrum."

The webinar takes place on June 18th at 1:00 PM EDT. Click here to register or get more information on the webinar, including panelist bios.

About InterDigital®

InterDigital develops technologies that are at the core of mobile devices, networks, and services worldwide. We solve many of the industry's most critical and complex technical challenges, inventing solutions for more efficient broadband networks and a richer multimedia experience years ahead of market deployment. InterDigital has licenses and strategic relationships with many of the world's leading wireless companies. Founded in 1972, InterDigital is listed on NASDAQ and is included in the S&P MidCap 400® index.

InterDigital is a registered trademark of InterDigital, Inc.

For more information, visit: www.interdigital.com.

CONTACT: Patrick Van de Wille
         Email: [email protected]
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