Tegal (TGAL) Launches ProNova ICP Source for DRIE Series Products

July 28, 2009 5:04 PM EDT

Tegal Corporation, (Nasdaq: TGAL) launched ProNova(TM), the company's third-generation high-density Inductively Coupled Plasma (ICP) reactor for Tegal DRIE Series Wafer Processing Products. Targeted for fast-growing MEMS and 3D IC applications, delivery of the ProNova has already begun, with the first order going to a new Tegal customer in the EU (see related announcement).

eparately today, Tegal also announced the ProNova User Group, a global network of ProNova DRIE process demonstration sites in Europe, North America, and Japan. Advanced characterization work and customer process demonstrations are already being carried out in the greatly expanded process window opened by ProNova.


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