Cree (CREE) Reaches Patent Agreement with Toyoda Gosei

May 28, 2008 9:05 AM EDT

Cree (Nasdaq: CREE) today announced that it has entered into an agreement with Toyoda Gosei providing the companies with access to each other's patented LED chip and packaged LED technology. Cree and Toyoda Gosei both hold broad and substantial optoelectronic patent portfolios. The agreement will make it easier for both companies to develop and manufacture LED products without concern for the other's patents.

Terms of the agreement were not disclosed.

Cree, Inc. develops and manufactures semiconductor materials and devices primarily based on silicon carbide (SiC), gallium nitride (GaN), and related compounds.


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