Applied Materials (AMAT) Announces Endura(R) Extensa(TM) PVD and New eHARP System

July 15, 2008 8:12 AM EDT

Applied Materials, Inc.(Nasdaq: AMAT) today announced its Applied Endura(R) Extensa(TM) PVD(1), the industry's only production-worthy system for depositing the critical barrier films for copper interconnects in sub-55nm memory chips. The Extensa system's unique titanium/titanium nitride (Ti/TiN) process technology enables diffusion barrier films with benchmark step coverage and less than 3% film thickness non-uniformity across the wafer, while achieving best-in-class defectivity and greater than 25% lower CoC(2) than competing systems.

Separately, Applied Materials also announced that its Applied Producer(R) eHARP(TM) system, extending the production-proven HARP SACVD(R)(1) gap-fill technology for critical STI(2) device structures to 32nm and beyond. The eHARP process delivers void-free films to fill less than 30nm, greater than 12:1 aspect ratio features -- essential requirements for the fabrication of advanced memory and logic devices. Featuring proprietary new process innovations, the eHARP system's robust, high-density, strain-inducing films enable the scaling of conventional planar and emerging 3-D device structures.

The Producer eHARP technology offers the lowest overall cost-per-wafer compared to non-CVD gap-fill technologies. Virtually carbon-free, the eHARP film requires no protective liners or capping layers, easily integrates with conventional CMP processes and provides reliable, robust device isolation. In addition, the eHARP system's proven process chemistries do not generate hazardous liquid byproducts that would necessitate specialized chemical disposal.

Applied Materials, Inc. designs, manufactures, and sells semiconductor fabrication equipment worldwide.

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